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Laser drilling plate machining method adopting secondary outer-layer core material for reducing copper

A technology of laser drilling and processing methods, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., to achieve the effect of extensive promotion, improve product yield, and solve the problem of laser hole breakdown

Inactive Publication Date: 2014-07-09
DALIAN PACIFIC ELECTRONICS
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  • Abstract
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Problems solved by technology

The present invention mainly utilizes the method of reducing copper on the sub-outer core material, thus solving the contradiction between the pattern layer requiring thinner copper foil and the laser hole receiving plate requiring thicker copper foil

Method used

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  • Laser drilling plate machining method adopting secondary outer-layer core material for reducing copper
  • Laser drilling plate machining method adopting secondary outer-layer core material for reducing copper

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Embodiment Construction

[0023] The invention relates to a laser drilling board processing method using sub-outer layer core material to reduce copper, which includes sub-outer layer pattern making, lamination and laser drilling.

[0024] Such as figure 1 As shown, take the example of reducing the base copper thickness of the sub-outer core material from 0.5OZ to 0.33OZ:

[0025] The sub-outer core material 1 is made of 0.5OZ-based copper 1a, and a dry film 2 is pasted on it, and the film 3 is covered. Under the irradiation of ultraviolet light 4, the light-receiving dry film 2a under the empty area 3a without chemical film is developed. Retained on the sub-outer core material 1, through the action of copper reduction, the exposed 0.5OZ base copper 1a is thinned by about 3-4um to become a 0.5OZ base copper thinning layer 1c, while the light-receiving dry film 2a protects The 0.5OZ base copper 1a becomes the 0.5OZ receiving plate 1b; after subsequent lamination, skylight layer fabrication, and laser ...

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Abstract

The invention discloses a laser drilling plate machining method adopting a secondary outer-layer core material for reducing copper. The laser drilling plate machining method is characterized by comprising secondary outer-layer graph manufacturing, laminating and laser drilling. The laser drilling plate machining method specifically comprises the following steps that a secondary outer-layer core material is selected; a secondary outer-layer bearing plate is manufactured; a secondary outer-layer graph is manufactured; a skylight layer is manufactured; laser drilling is performed on a skylight printed board. In the machining process of a laser drilling plate, 0.5OZ copper foil is used for replacing 0.33OZ copper foil in the secondary outer-layer graph of a printed circuit board, the copper reducing technology is adopted, so that when laser drilling is performed, the problem of laser hole breakdown is completely solved, and the product yield is greatly improved. The conflict that the graph layer requires thinner copper foil and the laser hole bearing plate requires thicker copper foil is removed, and the wide promotional significance is achieved.

Description

technical field [0001] The invention relates to a processing method of a printed circuit board by a laser drilling process, in particular to a processing method of a laser drilling board using a sub-outer core material to reduce copper. Background technique [0002] With the rapid development of microelectronics technology, the continuous improvement of PCB technology level and the wide application of large-scale or even ultra-large-scale integrated circuits, ordinary mechanical CNC drilling machines can no longer meet the requirements for buried / blind holes in a large number of HDI circuits, and lasers must be used. Drilling technology. The emergence and rapid development of laser drilling technology is a remarkable symbol of the technological development of the PCB industry and a revolution in the development of PCB drilling technology. At present, there are generally two popular laser drilling methods in the industry: window opening method and direct laser drilling metho...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 樊智洪王人伟孟祥胜李洪臣
Owner DALIAN PACIFIC ELECTRONICS
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