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Chemical stripping solution and stripping method

A stripping solution and chemical technology, applied in the field of stripping, can solve the problems of substrate corrosion and environmental pollution, and achieve the effect of fast stripping speed.

Inactive Publication Date: 2014-07-16
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0024] The present invention effectively solves the problem that the stripping agent used in the chemical stripping method in the prior art produces volatile stimulating gases harmful to the environment and the human body, and at the same time seriously corrodes the matrix with the stripping solution, and proposes a solution Methods

Method used

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  • Chemical stripping solution and stripping method

Examples

Experimental program
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Effect test

Embodiment 1

[0052] The test material is a 10mm×10mm×2mm red copper plate, which is put into the sulfuric acid with a mass percentage of 98% sulfuric acid 400g / L, hydrogen peroxide with a mass percentage of 30% hydrogen peroxide 150g / L, and a thiourea content of 50g / L. Deplating solution, the reaction temperature is 80°C. The copper plate reacts quickly in the deplating solution and dissolves completely, and the reaction speed is 55 μm / min (thickness direction of the plate).

Embodiment 2

[0054] The test material is a nickel plate of 10mm×10mm×2mm, which is put into the sulfuric acid with a mass percentage of 98% sulfuric acid 300g / L, hydrogen peroxide with a mass percentage of 30% hydrogen peroxide 120g / L, and a thiourea content of 30g / L. Deplating solution, the reaction temperature is 75°C. The nickel plate reacts quickly in the deplating solution and dissolves completely, and the reaction speed is 57μm / min (thickness direction of the plate).

Embodiment 3

[0056] The test material is a copper-plated stainless steel piece of 20mm×12mm×0.32mm. The base stainless steel is 304L, and the thickness of the copper plating layer is 0.02mm. 30% hydrogen peroxide 100g / L, deplating solution with urotropine content of 50g / L, and the deplating temperature is 20°C. The copper plating layer reacts in the stripping solution, wherein the copper plating layer is stripped, the stripping is complete, and the carbon steel substrate does not appear to be seriously corroded. The deplating speed is 23 μm / min (thickness direction of the coating).

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Abstract

The invention provides a chemical stripping solution and a stripping method, belonging to the technical field of stripping. The chemical stripping solution comprises sulfuric acid, hydrogen peroxide and a water solution of corrosion inhibitors, wherein the corrosion inhibitors are organic matters containing nitrogen or sulfur and the like or are high-polarity organic compounds containing -COOR, -COOH, -CHO, triple bonds (Cis equivalent toC) or poly-hydroxy-OH and the like. The stripping solution has high stripping speed and can strip nickel and copper plated layers with thickness of 0.2mm within two minutes at an appropriate temperature.

Description

technical field [0001] The invention relates to a chemical deplating solution and a suitable temperature for using the chemical deplating solution. In particular, it relates to a chemical deplating solution that effectively removes copper and nickel coatings on steel and rubber surfaces and reduces or prevents base material corrosion, and belongs to the technical field of degrading. Background technique [0002] Copper-plated and nickel-plated workpieces are widely used in people's production and life. Copper and nickel plating on the metal surface has many advantages and good performance, mainly in the following aspects [0003] 1. The electroplated copper and nickel layers have high stability in the air. Due to the strong passivation ability of metal copper and nickel, a very thin passivation film can be quickly formed on the surface, which can resist the atmosphere, alkali and certain Some acid corrosion; [0004] 2. Electroplated copper and nickel crystals are extreme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C23F1/28
Inventor 夏志东王峰李婷婷庞艺雷永平郭福
Owner BEIJING UNIV OF TECH
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