Reinforcing laminating device for flexible printed circuit board

Abstract

The invention discloses a reinforcing laminating device for a flexible printed circuit board. The reinforcing laminating device for the flexible printed circuit board comprises a machine table, a reinforcing sheet manufacturing mechanism, a reinforcing sheet sucking mechanism and a locating assembly, wherein the reinforcing sheet manufacturing mechanism, the reinforcing sheet sucking mechanism and the locating assembly are all fixed to the table face of the machine table. The reinforcing sheet sucking mechanism comprises a rotation driving device, a rotating frame driven to rotate through the rotation driving device and at least three sucking assemblies for sucking reinforcing sheets, the rotating frame is mounted at the output end of the rotation driving device, the rotating frame is provided with ends, the number of the ends is identical to that of the sucking assemblies, and all the ends are symmetrically distributed relative to the rotating central axis of the rotating frame. Each sucking assembly is matched with one corresponding end in the vertical direction in telescopic sliding modes. A first CCD camera is further fixed to the table face of the machine table, and when one of the sucking assembly directly faces the first CCD camera, the other two sucking assemblies are located over the output end of the reinforcing sheet of the reinforcing sheet manufacturing mechanism and over the locating assembly respectively. The reinforcing laminating device for the flexible printed circuit board can efficiently laminate the reinforcing sheets on the flexible printed circuit board.

Description

[0001] technical field [0002] The invention relates to a technology for attaching reinforcing sheets, in particular to a reinforcing bonding device for a flexible circuit board. Background technique [0003] Flexible circuit boards (FPC, Flexible Printed Circuit board) generally use reinforcing sheets to increase the strength of the substrate of the flexible circuit board. The electrical connection between the reinforcing sheet and the substrate is bonded by high-temperature heating, and hot pressing is used to ensure reliability. [0004] At present, there is a laminating machine for automatic mounting of reinforcing sheets on flexible circuit boards, which can complete the transportation of reinforcing sheets, adsorption of reinforcing sheets, alignment and pressing of reinforcing sheets on flexible circuit boards. Although this process is fully automatic, there are the following defects in this bonding process: (1) The reinforcement sheet needs to be punched and process...

AI Technical Summary

Problems solved by technology

[0004] At present, there is a laminating machine for automatic mounting of reinforcing sheets on flexible circuit boards, which can complete the transportation of reinforcing sheets, adsorption of reinforcing sheets, alignment and pressing of reinforcing sheets on flexible circuit boards. Although this process is fully automatic, there are the following defects in this bonding process: (1) The reinforcement sheet needs to be punched and processed before being input into the placement machine, which increases the transit labor force, and is used for punching the reinforcement sheet. The efficiency of the machine is low; (2) The laminating machine relies on a suction head to absorb the reinforcement sheet, and the suction, alignment, and lamination of the reinforcement sheet are realized step by step by moving the suction head. The movement is slow and it is difficult to meet the high-speed Production; (3) The degree of freedom of the suction head is not enough, it is difficult to adjust the relative position of the reinforcement sheet by adjusting the suction head, resulting in low subsequent lamination accuracy, and the flexible circuit board itself is not accurately aligned, which also leads to The bonding accuracy is not high; (4) PI (polyimide) board is generally used as the body of the reinforcing board, and the bottom surface is provided with an adhesive to increase the adhesion when mounting with the substrate of the flexible circuit board

Therefore, the reinforcement sheets formed by the reinforcement board after punching need to peel off the release paper. The prior art generally adopts a robot arm or a robot for peeling off each reinforcement sheet. Manual peeling, and then conveying to the position to be grasped for subsequent placement process, the efficiency is low and the cost is high. Moreover, the stripped paper pieces are scattered, which is not conducive to storage and storage, and is easy to scatter and damage the working environment

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