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Composite base plate for drilling PCB (printed circuit board) and preparation method thereof

A technology of composite backing plate and substrate, applied in drilling/drilling equipment, chemical instruments and methods, manufacturing tools, etc., can solve the problems of high cost, ordinary melamine wood backing plate does not meet the requirements of high-precision drilling, etc. Achieve the effect of increasing hardness, meeting the requirements of small-diameter drilling, and improving the effect of chip removal and heat dissipation

Active Publication Date: 2014-07-23
SHENZHEN NEWCCESS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a composite backing board for PCB drilling and its preparation method and application, aiming at solving the problem of the high cost of the phenolic laminate for PCB drilling and the common melamine wood backing board. The problem of not meeting the requirements of high-precision drilling

Method used

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  • Composite base plate for drilling PCB (printed circuit board) and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The high-density fiberboard adopted in Example 1 has a hardness of 80hd, a density of 900kg / m3, and a thickness of 2.2mm.

[0034] Use a 1.5 cubic meter reaction tank to produce modified urea-formaldehyde resin. Melamine-modified urea-formaldehyde resin refers to adding melamine (melamine) to the synthetic raw material of urea-formaldehyde resin. The specific ratio of raw materials in parts by weight is as follows: 550 parts of formaldehyde, 25 parts of urotropine, 75 parts of melamine, 200 parts of urea, 200 parts of methanol, 50 parts of diethylene glycol, and 50 parts of water.

[0035] The specific preparation process is as follows: sequentially add urotropine, melamine and urea into a reaction kettle. Raise the temperature of the reactor to 75°C for reaction, then keep it warm for 60 minutes, add methanol, then raise the temperature to 73°C, and keep it warm for 2 hours, then add diethylene glycol solution, and pass water to cool down and discharge.

[0036] Utili...

Embodiment 2

[0044] The high-density fiberboard adopted in Example 2 has a hardness of 85hd, a density of 950kg / m3, and a thickness of 2mm.

[0045] Use a 1.5 cubic meter reaction tank to produce modified urea-formaldehyde resin. Melamine-modified urea-formaldehyde resin refers to adding melamine (melamine) to the synthetic raw material of urea-formaldehyde resin. Its specific raw material ratio is as follows: 600 parts of formaldehyde, 40 parts of urotropine, 100 parts of melamine, 150 parts of urea, 150 parts of methanol, 25 parts of diethylene glycol, and 25 parts of water.

[0046] The specific preparation process is as follows: sequentially add urotropine, melamine and urea into a reaction kettle. Raise the temperature of the reactor to 70°C for reaction, then keep it warm for 20 minutes, add methanol, then raise the temperature to 70°C, and keep it warm for 1 hour, then add diethylene glycol solution, and pass water to cool down and discharge.

[0047] Utilize the modified urea-formal...

Embodiment 3

[0052] The high-density fiberboard adopted in embodiment 3 has a hardness of 75hd, a density of 900kg / m3, and a thickness of 2.1mm.

[0053] Use a 1.5 cubic meter reaction tank to produce modified urea-formaldehyde resin. Melamine-modified urea-formaldehyde resin refers to adding melamine (melamine) to the synthetic raw material of urea-formaldehyde resin. The specific ratio of raw materials in parts by weight is as follows: 550 parts of formaldehyde, 26 parts of urotropine, 75 parts of melamine, 200 parts of urea, 200 parts of methanol, 50 parts of diethylene glycol, and 50 parts of water.

[0054] The specific preparation process is as follows: sequentially add urotropine, melamine and urea into a reaction kettle. Raise the temperature of the reactor to 73°C for reaction, then keep it warm for 30 minutes, add methanol, then raise the temperature to 70°C, and keep it warm for 1.5 hours, then add diethylene glycol solution, and pass water to cool down and discharge.

[0055] ...

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Abstract

The invention discloses a composite base plate for drilling a PCB (printed circuit board) and a preparation method thereof. A high-density fiber plate is taken as a base plate for the composite base plate; the upper surface and the lower surface of the base plate are respectively laminated with lamination inner paper and melamine surface paper sequentially and are compressed under a preset condition so as to form the composite base plate, wherein the lamination inner paper is formed by impregnating kraft paper with urea formaldehyde resin; the melamine surface paper is formed by impregnating balanced paper with urea formaldehyde resin modified from melamine. The composite base plate provided by the invention has obviously improved surface hardness, and can be used for solving the problems of curling of a traditional base plate and poor heat radiation effect, improving the chip removing and heat radiation effects, reducing the problems of excessive flashing and hole shift in the drilling process, improving the hole position precision, and meeting the small-pre-diameter hole drilling requirement.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a composite pad for PCB drilling and a preparation method thereof. Background technique [0002] At present, one of the backing plates for drilling printed circuit boards (hereinafter referred to as PCB) in the market is phenolic laminated board. This kind of phenolic laminated board is expensive, and its production has a great impact on the environment, and the backing board is easy to warp. warp, poor flatness, the other is ordinary melamine wood backing board, its cost is low but there are problems of peaking, burrs and poor hole position accuracy in use. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention [0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a composite backing board for PCB drilling and its preparation method and applicati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B29/02B32B29/06B32B27/04B23B47/00
Inventor 邱波杨柳杨勇成
Owner SHENZHEN NEWCCESS IND
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