A silicon wafer support device

Abstract

The invention discloses a silicon slice supporting device which comprises an annular supporting ring and a plurality of supporting legs, wherein the annular supporting ring is arranged at the upper end of a silicon slice storage platform in a semi-conductor process device silicon slice conveying system, and the supporting legs are arranged on the circumference of the supporting ring and used for supporting silicon slices. The silicon slice supporting device is characterized in that the supporting legs are cylindrical, silicon slice supporting surfaces are arranged at the upper ends of the supporting legs, and the lower ends of the supporting legs are connected with the supporting ring. The inner diameter of the supporting ring is smaller than the diameter of a circle defined by the inner sides of the silicon slice supporting surfaces of the supporting legs. By shortening lengths of the supporting legs in the horizontal direction, the outer diameter of the supporting ring is shortened, floor space of the storage platform is reduced, and the silicon slices cannot fall to the ground and be broken from the position of the inner diameter of the supporting ring when sliding out of the supporting device due to offset. The silicon slice supporting device has the remarkable advantages of being simple in structure, easy to implement and capable of reducing floor space and decreasing the breakage rate of the silicon slices.

Description

technical field [0001] The invention relates to a silicon wafer storage platform in a silicon wafer transmission system of semiconductor process equipment, and more particularly, to a silicon wafer support device for a silicon wafer storage platform in the silicon wafer transmission system of semiconductor process equipment. Background technique [0002] Semiconductor manufacturing is a series of cycles and repetitions of major process steps. Many fabrication processes involve chemical reactions that take place within the process chamber of semiconductor process equipment. Today, the processing of semiconductor silicon wafers usually involves chemical reactions that take place in process chambers. [0003] According to different processing processes, silicon wafers often need to be transported between process chambers of multiple semiconductor process equipment through a silicon wafer conveying system. In the process equipment, the main function of the silicon wafer convey...

AI Technical Summary

Problems solved by technology

Although the design form of this device can easily meet the hand-in space of the manipulator by adjusting the position of the supporting feet, so as to facilitate the operation of the manipulator, there are also obvious problems at the same time: because the silicon wafer supporting surface of the supporting feet is located on the supporting surface of the supporting feet The front end of the foot, and the assembly position with the support ring is located at the rear end of the support foot, so that the inner diameter of the support ring is larger than the outer diameter of the silicon wafer, and the outer diameter of the support ring exposes a lot of parts of the outer diameter of the silicon wafer

The defect caused by this problem is that, on the one hand, the design of the entire storage platform takes up a large area; on the other hand, during the failure or debugging of the manipulator, the silicon wafer slips out of the support due to the weak grip or deviation of the manipulator. The device falls to the ground and breaks from the inner diameter of the support ring, which not only causes certain economic losses, but also affects the production efficiency of the equipment

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