A high-power LED COB flip-chip packaging structure for automotive lighting
A flip-chip packaging, high-power technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems that the LED lighting source cannot meet the design requirements, affect the direct use of light, and affect the transfer of heat, etc., to achieve Small power, good cooling effect, long life effect
Active Publication Date: 2016-11-16
JIANGSU HONGCHANG SCI & TECH
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Problems solved by technology
However, subject to the requirements of the national standard for the design of automotive headlights, LED lighting sources with ordinary packaging structures cannot meet the design requirements very well.
[0003] At present, the packaging of ordinary lighting sources at home and abroad mostly adopts direct packaging and then coating with fluorescent glue. The packaging structure has the following problems: 1. The power of a single chip in automotive lighting can reach 2∽3W. When COB packaging is used, the heat density is very high, and the sapphire substrate directly packaging the chip affects the heat transfer; 2. Automotive lighting The light source is an occasion where the light efficiency is very high. The light output efficiency of the directly packaged chip is more than 20% lower than that of the flip chip, which affects the direct use of light; Fluorescent glue will cause its aging failure
Method used
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Embodiment 1
[0016] Such as figure 1 , figure 2 As shown, it is a schematic diagram of the 4×1 COB packaging structure used in the LED chip of the automobile headlight according to the present invention, and the bracket 1 is made of aluminum nitride ceramics with a thickness of 0.6 mm. The upper part has a width of 10 mm and a height of 8 mm; the printed circuit 6 is located on the upper part of the support 1 for fixing the electrode 7 and powering the ESD protector 2 and the LED chip 3; the ESD protector 2 is connected in parallel with the LED chip 3 through the printed circuit 2 , the LED chip 3 is flip-chip packaged by connecting four CREE DA1000 chips in series, the four chips are arranged in a 4×1 manner, and the interval between each two is 0.2mm; the electrode 7 is located on the printed circuit board 1 for Connect the external power supply device; the ceramic fluorescent sheet 4 is pasted on the upper part of the LED chip 3 and fixed on the dam 5 .
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The invention discloses an LED (Light Emitting Diode) COB (Chip On Board) inverted packaging structure with large power for automotive lighting. The LED COB inverted packaging structure comprises a support (1), an ESD (Electronic Static Discharge) protector (2), an LED chip (3), a ceramic fluorescent piece (4), a box dam (5), a printing circuit (6) and an electrode (7), wherein the printing circuit (6) is located at the upper part of the support (1) and is welded with the electrode (7) needed by power supply, the LED chip (3) is packaged on the printing circuit (6) of the support (1), and the ceramic fluorescent piece (4) is fixed on the box dam (5); the ceramic fluorescent piece (4) is serially connected on the electrode (7), and the ESD protector (2) and the LED chip (3) are connected in parallel. The LED COB inverted packaging structure provided by the invention is good in lighting effect, and the LED chip in a light source structure adopts an inverted packaging method, so that the performances including the cooling effect, the optical output efficiency and the like are excellent.
Description
technical field [0001] The invention belongs to the technical field of semiconductor lighting, and in particular relates to a high-power LED COB packaging structure for vehicle lighting. technical background [0002] At present, with the gradual rise of LED as a new type of lighting source in the lighting market, its application range covers all aspects from household lighting such as desk lamps to public lighting such as street lamps. Thanks to the advantages of high light efficiency, small size and low power consumption of LED light source, its lighting effect in various lighting occasions far exceeds that of traditional light sources. Especially in the automotive lighting industry, it is an unstoppable trend for LEDs to replace traditional light sources. However, subject to the requirements of the national standard for the design of automobile headlights, the LED lighting source with a common package structure cannot meet the design requirements very well. [0003] At p...
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IPC IPC(8): H01L25/075H01L25/16H01L33/48
Inventor 杜正清葛爱明
Owner JIANGSU HONGCHANG SCI & TECH