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Preparation method for flexible heat-conducting pad

A thermal pad, flexible technology, applied in the field of preparation of flexible thermal pads, can solve the problems of large contact surface spacing, low thermal conductivity, and inapplicability, and achieve strong thermal conductivity, improved thermal conductivity, and flexible size adjustment Effect

Inactive Publication Date: 2014-08-06
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the surfaces of most heating elements and radiators in practical applications are relatively smooth, the powder particles mixed in common thermal conductive adhesives on the market are relatively small, so the thermal conductivity is relatively low
For the case where the contact surface of the heating element and the heat sink is relatively rough, this type of thermal conductive colloid on the market is not suitable. First, the thermal conductivity is too low. the edges gradually fall off

Method used

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  • Preparation method for flexible heat-conducting pad
  • Preparation method for flexible heat-conducting pad
  • Preparation method for flexible heat-conducting pad

Examples

Experimental program
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Effect test

preparation example Construction

[0023] The preparation method of a flexible thermal pad of the present invention includes: filling the thermal conductive material with good thermal conductivity and suitable size into the gaps of the metal foam, and the thermal conductive pad obtained is compared with the metal foam and the filling material before treatment. The ability is stronger, and the flexibility of the metal foam itself is retained; the thickness, thermal conductivity, Flexibility, etc.; the obtained thermal pad can be cut into any shape. For example, the thickness of the metal foam is basically the thickness of the thermal pad; the porosity determines the thermal conductivity and flexibility of the metal foam itself; the thermal conductivity of the filler is proportional to the thermal conductivity of the final thermal pad, that is, the same foam For metal, when the amount of filler is the same, the thermal conductivity of the gasket with better thermal conductivity will be better; generally, increasi...

Embodiment 1

[0035] 1) Cut the foamed copper into small pieces according to the design requirements, and treat in a reducing atmosphere composed of 800-1000 ℃, 150-200 sccm hydrogen and 800-1000 sccm argon for 15-40 minutes, preferably 30 minutes, to remove the foamed copper oxides on the surface.

[0036] 2) Fill the thermally conductive silicone grease into the processed copper foam. In this embodiment, the heat-conducting silicone grease is placed on the upper surface of the treated gold copper foam, and a scraper is used to squeeze the heat-conducting silicon grease into the voids of the foam copper.

[0037] After measurement, the thermal pad prepared by this method (see figure 2 Shown) The thermal conductivity at 30°C is 3.6W / (M*K), which is higher than the thermal conductivity of copper foam with the same parameters of 3.5W / (M*K).

Embodiment 2

[0039] see image 3 As shown, the preparation method is the same as in Example 1, except that the filling material is changed to a mixture of silicone grease and graphite powder, and its thermal conductivity is 5.0W / (M*K).

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Abstract

The invention relates to a preparation method for a flexible heat-conducting pad. The preparation method comprises the following steps: providing a foam metal; providing a heat-conducting material; and filling the foam metal with the heat-conducting material so as to form the heat-conducting pad. According to the invention, gaps of the foam metal are filled with the material with good heat-conducting performance and a proper size, so the prepared heat-conducting pad has better heat-conducting capability compared with the foam metal and the filling material before treatment and retains good flexibility of the foam metal; through adjusting parameters like thickness and porosity of the foam metal and parameters like variety, components and quality of the filling material, the thickness, heat conductivity coefficient, flexibility and the like of the heat-conducting pad can be controlled; the prepared heat-conducting pad can be cut into any shape. The preparation method has high repeatability and is simple and easily practicable.

Description

technical field [0001] The invention belongs to the field of preparation of heat-conducting materials, in particular to a preparation method of a flexible heat-conducting gasket. Background technique [0002] The heat dissipation capability of electronic components directly affects the working ability and service life of the device itself, so the heat dissipation of electronic components has always been a direction that researchers have paid attention to. At present, the heat dissipation of electronic devices is mainly by connecting the heating body (electronic components) with the heat sink (mostly made of aluminum or copper with a large specific surface area), and then using other methods (such as air cooling or water cooling) to connect the heat sink The heat transfers rapidly. In this heat dissipation method, the surfaces of the heating element and the radiator are not ideal planes, and a certain amount of gaps will be left at the interface after the heating element and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14C09K5/08
Inventor 张燕辉于广辉陈志蓥王彬张浩然
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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