Method for sintering silverskin on LED lamp holder made of thermal conductive plastics
A heat-conducting plastic and silver film technology, which is applied in the field of compounding metal conductors and plastics, can solve the problems of affecting the life of electronic devices and LEDs, poor heat conduction, blocking LED heat dissipation, etc., and achieves light weight, low cost, and high insulation Effect
Inactive Publication Date: 2014-08-27
何永祥 +2
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Problems solved by technology
The aluminum on the heat dissipation surface of the aluminum substrate must be insulated from the copper foil soldered with electronic devices, and there must be an insulating layer of epoxy resin in the middle, but the thermal conductivity of epoxy resin is very poor. In addition, the aluminum and the radiator cannot be welded and can only be glued by thermal conductivity. junction, so the epoxy resin and the heat-conducting glue double block the heat dissipation of the LED, which is the reason for the light decay of the current LED tube
Due to the inherent disadvantages of the aluminum substrate, it seriously affects the life of electronic devices and LEDs
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[0014] The purpose and effect of the present invention will become more obvious according to the present invention in detail according to the accompanying drawings and embodiments.
[0015] A method of sintering a silver film on a heat-conducting plastic LED lamp cap of the present invention comprises the following steps:
[0016] (1) if figure 1 As shown, the heat-conducting plastic welding surface 2 of the heat-conducting plastic lamp cap 1 is cleaned before treatment, and the surface grease and other dirt on the surface of the heat-conducting plastic welding surface 2 can be removed with absolute ethanol. 3. The effect of compounding the silver film 4 of the pad on the welding surface 2 of the heat-conducting plastic.
[0017] (2) Screen printing: Apply photosensitive glue on the screen, then put the film sheet printed with electronic circuits on the photosensitive glue, and expose it through an exposure machine. The part of the screen film that is not covered by the film ...
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The invention discloses a method for sintering a silverskin on an LED lamp holder made of thermal conductive plastics. A film printed with a circuit is placed on a silk screen coated with photosensitive glue, a transparent screen plate consistent with the circuit is formed on the silk screen through exposure, silver paste is printed on the welding surface of thermal conductive plastics and placed in a meshbeltfurnace to be dried and formed, the dried and formed thermal conductive plastics are placed in the meshbeltfurnace for sintering, temperature of the meshbeltfurnace is controlled at 150 DEG C, film forming time is 30 minutes, so that good fusing is formed between the silver paste and the welding surface of the thermal conductive plastics, and the silver sintering layer surface formed after sintering is a silver film; the circuit for sintering the silver film can also serve as a bonding pad for welding an electronic device or an LED so that heat generated by the electronic device or the LED can be dissipated through the thermal conductive plastics timely, an aluminum substrate is replaced, and welding and heat dissipation which are achieved by using the aluminum substrate in the prior art is achieved.
Description
technical field [0001] The invention relates to a technique for compounding metal conductors and plastics, in particular to a method for sintering silver films on heat-conducting plastic LED lamp caps. Background technique [0002] With the demand for high-end technology in the country, there are various high-level requirements for the performance of materials. Some requirements are not only high thermal conductivity, corrosion resistance, but also insulation, but also the ability to install electronic components. Metals such as plastic and silver can only meet some of these requirements. At present, only aluminum substrates using composite materials can meet the requirements. The aluminum on the heat dissipation surface of the aluminum substrate must be insulated from the copper foil soldered with electronic devices, and there must be an insulating layer of epoxy resin in the middle, but the thermal conductivity of epoxy resin is very poor. In addition, the aluminum and t...
Claims
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IPC IPC(8): B22F7/04
Inventor 何永祥李勇沈颖玲
Owner 何永祥