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LED (Light Emitting Diode) driving power supply integrated lamp holder

An LED driver and lamp head technology, applied in electric light source, electric light source, electroluminescent light source, etc., can solve the problems of shortened working life of power supply, unstable working state, and increased difficulty in heat dissipation design.

Inactive Publication Date: 2014-10-15
赵依军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, LED driving power is often built into the lighting device to form a new heat source, which undoubtedly increases the difficulty of heat dissipation design
On the other hand, the heat generated by the LED may also be conducted to the driving power supply, resulting in shortened working life of the power supply and unstable working conditions, etc.

Method used

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  • LED (Light Emitting Diode) driving power supply integrated lamp holder
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  • LED (Light Emitting Diode) driving power supply integrated lamp holder

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Embodiment Construction

[0082] The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention may, however, be embodied in different forms and should not be construed as limited to only the embodiments set forth herein. The given above-mentioned embodiments are intended to make the disclosure herein comprehensive and complete, and to more fully convey the protection scope of the present invention to those skilled in the art.

[0083] In this specification, unless otherwise specified, the term "semiconductor wafer" refers to a plurality of independent individual circuits formed on a semiconductor material (such as silicon, gallium arsenide, etc.), a "semiconductor wafer" or "die ” refers to such individual circuits, while “packaged chip” refers to the packaged physical structure of a semiconductor die, typically such as mounted on a carrier and encapsulated with an encapsulant.

[00...

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Abstract

The invention relates to a semiconductor lighting technology, in particular to an LED (Light Emitting Diode) driving power supply integrated lamp holder. According to one embodiment of the invention, the lamp holder comprises a shell which comprises a base, sidewalls, electrical contact components and an LED driving power supply, wherein the base is made from an insulating material; the sidewalls are fixedly arranged on the base, and at least part of each sidewall is made from a conductive material; the electrical contact components are fixedly arranged at the bottom of the base; the LED driving power supply comprises a substrate, an LED driving circuit and first and second input electrodes, wherein the substrate is fixedly arranged in a space defined by the base and the sidewalls; the LED driving circuit is arranged on the substrate; the first and second input electrodes are arranged on the substrate and are electrically connected with conductive parts of the sidewalls and the electrical contact components respectively.

Description

technical field [0001] The invention relates to semiconductor lighting technology, in particular to a lamp holder integrating an LED driving power supply. Background technique [0002] In the field of lighting, the application of light-emitting diode (LED) light source products is attracting the attention of the world. As a new type of green light source product, LED has the characteristics of energy saving, environmental protection, long life and small size. It can be widely used in various indications, displays, decorations, backlights, general lighting and urban night scenes. [0003] LED is a solid-state semiconductor device, and its basic structure generally includes a bracket with leads, a semiconductor chip set on the bracket, and a packaging material (such as fluorescent silicone or epoxy resin) that seals the surroundings of the chip. The above-mentioned semiconductor wafer contains a P-N structure. When the current passes through, electrons are pushed to the P reg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V23/00H05B37/02F21Y101/02H05B44/00
CPCH05B33/0818F21Y2101/02F21S2/00H05B37/02F21K9/13F21V23/006F21Y2115/10F21K9/238F21K9/235H05B45/375H05B45/3725Y02B20/00H05B45/38F21V23/008F21V23/06
Inventor 赵依军
Owner 赵依军
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