3d‑ic with complex microchannel fluid cooling between layers

Abstract

The invention discloses a 3D-IC with an inter-layer complex microchannel fluid cooling function and belongs to the technical field of 3D-IC micro-electronic heat radiation. The 3D-IC includes a sealing plate, chip layers with complex microchannels and connection layers, which are sequentially laminated and packaged together. The sealing plate is provided with a fluid entrance and a fluid exit, which are connected with external pipes. The chip layers include through holes TSFVs which connect fluids at upper and lower layers, back etching complex microchannels and front-face arrangement circuit layers or microelectronic components, and the upper layer does not need any TSEV, but other layers need TSEVs. The 3D-IC with the inter-layer complex microchannel fluid cooling function adopts the complex microchannels, compared with a micro pin fin structure, the inter-layer connection strength of a chip is strengthened and at the same time, the chip strength is also increased; the TSEVs adopt a tungsten or a tungsten copper material so that the thermal compatibility of heterogeneous materials is strengthened; and a filling material of the connection layers adopts a polyimide composite thin film doped with inorganic nano particles so that the thermal compatibility is strengthened and the thermal conductivity is increased. Therefore, defects of application restriction of heat sink of microchannels and nonuniform temperature distribution of a chip are compensated for.

Description

technical field [0001] The invention belongs to the technical field of 3D-IC microelectronic heat dissipation, and relates to a micro-cooling structure, in particular, the dislocation complex micro-channel can effectively take away the heat of the chip and realize a relatively uniform temperature distribution. At the same time, tungsten or tungsten copper is used as TSEV material, and doped inorganic nanoparticles with good thermal conductivity (such as SiO 2 、TiO 2 、Al 2 o 3 , AlN, C, etc.) polyimide composite film as the filling material of the connection layer enhances the matching of heterogeneous materials and enhances heat transfer. Background technique [0002] In recent years, there have been many studies on 3D-IC (integrated circuit) integration technology, architecture design, cost analysis, temperature control, circuit planning, and reliability analysis at home and abroad. With the development of VLSI and the continuous improvement of application requirements,...

AI Technical Summary

Problems solved by technology

However, if too many thermal vias are inserted between the chips, the reliability of the chip will be reduced; in addition, too many thermal vias will inevitably lead to the reduction of wiring resources.

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