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Bonding separation method and separation device

A separation method and bonding technology, which is applied in the direction of chemical instruments and methods, layered products, lamination, etc., can solve the problems of limited support substrate materials, difficulty in manufacturing laminates, and reduced adhesion, achieving excellent convenience Effect

Active Publication Date: 2014-11-12
SHIN ETSU ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in such a conventional bonding and separating method and separating device, the bonded substrate is irradiated with specific ultraviolet light, thereby reducing the adhesiveness of the bonding layer disposed between the thin plate glass and the supporting substrate, thereby enabling peeling. Therefore, when the support substrate contains a light-shielding material, the thin plate glass cannot be easily peeled off without reducing the adhesiveness of the bonding layer.
[0005] As a result, the material of the supporting substrate is limited, so there is a problem that the electronic components that can be manufactured are also limited.
[0006] In addition, it is difficult to carry out the method of peeling the support substrates from the bonded sheet glasses after joining the two bonded substrates so that the sheet glasses face each other, since the support substrates do not deform.
[0007] Therefore, there is also a problem that it is difficult to manufacture a laminated body in which thin glass sheets are bonded together.

Method used

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  • Bonding separation method and separation device
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  • Bonding separation method and separation device

Examples

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Embodiment 1

[0093] Next, various embodiments of the present invention will be described with reference to the drawings.

[0094] Such as Figure 1 ~ Figure 3 or Figure 4 As shown, in this embodiment 1, the sealing member 3 is composed of an adhesive material that can be dissolved by the dissolving solution L, and in the separation step, at least a part of the sealing member 3 bonded to the substrate 4 is immersed in the dissolving solution L, thereby In the solution L, the vacuum space S is opened to the atmosphere.

[0095] Such as image 3 or Figure 4 As shown, the separation device B1 serving as the thin substrate 1 and the support substrate 2 includes a liquid tank 30 for storing the solution L, and a seal member 3 installed in the liquid tank 30 so as to be bonded to the bonded substrate 4 immersed in the solution L. At least a part of the penetrating member 20 is opposite and relatively movable.

[0096] exist image 3 In the examples shown in (a) to (c), as the liquid tank ...

Embodiment 2

[0106] Such as Figure 5 ~ Figure 7 or Figure 8 Shown, the following structure of this embodiment 2 and Figure 1 ~ Figure 3 or Figure 4 The illustrated embodiment 1 is different, except that the structure is the same as that of the embodiment 1, that is, in the overlapping step, after bonding the bonded substrates 4 to each other to form the bonded substrate group 5, in the separating step, the bonded substrate group 5 is formed under atmospheric pressure. At least a part of the sealing member 3 of each bonded substrate 4 in the bonded substrate group 5 is removed in an atmosphere (in air or liquid), and the vacuum space S is released to the atmosphere, thereby peeling off the thin plate substrates 1 and bonding them to each other. The laminated body 6 and the pair of support substrates 2 are formed.

[0107] The bonding apparatus A2 which bonds the board|substrate 4 together is demonstrated.

[0108] As an example of a program set in the control section of the bonding ...

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Abstract

The invention provides a bonding separation method and a separation device to separate a thin substrate from a supporting substrate easily by vacuum break without difficulty. In an atmosphere of atmospheric pressure, a through hole is provided by inserting at least one portion of a sealing member (3) of a bonded substrate (4) into a through part, so that airtight of a vacuum space (S) which is airtightly held in a vacuum state inside the sealing member (3) previously is broken, and a fluid such as air or liquid enters the vacuum space (S) once and opened by the air. By the air opening, the sealing member (3) is pushed by pressure generated by the atmospheric pressure from the outside and pressure of the fluid entering into the vacuum space (S) from both outside and inside, so that the sealing member (3) becomes thin and the thin substrate (1) can be easily separated from the supporting substrate (2) without deforming the thin substrate (1).

Description

technical field [0001] The present invention relates to a bonding and separating method for performing predetermined processing on thin substrates such as thin cover glass or films in flat panel displays (FPDs), touch panels, 3D (3-dimensional) displays, electronic books, etc. And a separating device for implementing the bonding and separating method. Background technique [0002] Conventionally, as such a bonding and separating method and separating device, there is a bonding and separating method and separating device in which a groove structure is formed on the surface of a light-transmitting insulating substrate. A bonding resin whose adhesion is reduced by irradiation of specific ultraviolet light is applied to the space of the groove to form a bonding layer, and a thin glass plate (first substrate) including a light-transmitting insulating substrate is bonded thereon. After the bonded substrate is formed, an electronic component (device) is formed using the bonded sub...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/67H01L21/68
CPCH01L21/6835H01L2221/68381G02F1/1303H01J9/241B32B38/10H10K71/00
Inventor 横田道也
Owner SHIN ETSU ENG
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