Substrate Integrated Waveguide Bandpass Filter

Abstract

The invention discloses a substrate integrated waveguide bandpass filter. It includes a first metal layer, a dielectric layer and a second metal layer stacked from top to bottom; the above-mentioned first metal layer includes a first transmission line main line, a second transmission main line, a first gradual transition line, a second gradual transition line and The first metal plate, the above-mentioned first metal plate includes a first strip-shaped opening, a second strip-shaped opening, a third strip-shaped opening, a fourth strip-shaped opening, a fifth strip-shaped opening, a first circular opening and a second circular opening; the dielectric layer includes a dielectric substrate, a first metallized through hole, a second metallized through hole, a first metallized groove, a second metallized groove, a third metallized groove, and a second metallized groove. For the fourth metallization slot and the fifth metallization slot, the above-mentioned second metal layer includes a dummy metal plate. The beneficial effect of the invention is that: the insertion loss caused by radiation is reduced, the limitation of processing technology is avoided, and the substrate integrated filter can be applied to high frequency band filtering.

Description

technical field [0001] The invention belongs to the technical field of microwave and millimeter wave passive devices, in particular to a substrate integrated waveguide bandpass filter. Background technique [0002] At present, commonly used filters that allow signals of a specific frequency band to pass through while shielding signals of other frequency bands mainly include: microstrip line type, waveguide type, and lumped capacitive inductive element type. The basic composition of microstrip line type, waveguide type and lumped element type includes the main line of the transmission line, several resonant units connected to the main line of the transmission line and the coupling unit connected to the resonant unit. When the energy transmitted on the main line of the transmission line is coupled to a resonant unit through a coupling unit, the same frequency as the resonant unit resonant frequency resonates in the resonant cavity, and at the same time enters the next resonant...

AI Technical Summary

Problems solved by technology

Due to the limitations of the current processing technology, it is difficult to achieve too small a via hole pitch and a via hole. In the high-frequency band, due to the small wavelength, especially when the wavelength reaches the via hole pitch level, electromagnetic waves are easily radiated from the via holes, resulting in filter insertion loss. At the same time, the coupling unit of the bandpass filter in the high frequency band needs to be realized with a small pass, and the limitation of the processing technology makes this excellent filter unable to be used in the higher frequency band

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