Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Dimple-shaped honeycomb hollow plate and manufacturing method thereof

A manufacturing method and technology of dimples, which are applied in the field of dimple-shaped honeycomb hollow boards and their manufacture, and the manufacture of multi-layer co-extruded hollow boards, which can solve problems such as instability, poor impact resistance, and compression deformation.

Inactive Publication Date: 2014-12-03
NINGBO TIANQI HONEYCOMB MATERIALS
View PDF3 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the deficiencies of the above-mentioned prior art, and provide a dimple-shaped honeycomb hollow board to solve the shortcomings of the existing plastic hollow boards, such as poor impact resistance, deformation under pressure, and infirmity, and has high strength, pressure resistance, and wear resistance. , heat insulation, impact resistance and fracture resistance, etc., can bear the force of transverse section, longitudinal section and front surface of the board at the same time, the force on each side is uniform, the application range is wide, and the use effect is good

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dimple-shaped honeycomb hollow plate and manufacturing method thereof
  • Dimple-shaped honeycomb hollow plate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0022] A dimple-shaped honeycomb hollow panel, characterized in that: the internal structure of the dimple-shaped honeycomb hollow panel includes an upper skin layer, a dimple-shaped honeycomb structure layer and a lower skin layer, and the dimple-shaped honeycomb structure layer is up and down. Staggered mosaic sandwich sandwich structure.

[0023] The composition and percentage weight ratio of the inner structure of the upper skin layer are: 78% polypropylene, 12% talcum powder, 2% polyethylene, 1% maleic acid, 1% calcium carbonate, 1% titanium dioxide , 1% Al2O3, 0.5% Antioxidant 1010, 0.1 UV Absorber UV-327, 0.4% Coupling Agent KH-550, 3% Masterbatch uniformly mixed, dried at 120°C for 2 hours The upper skin layer mixture is obtained.

[0024] The composition of the internal structure of the dimple-shaped honeycomb structure layer and its...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a dimple-shaped honeycomb hollow plate and a manufacturing method thereof, which belong to a manufacturing method of a multilayer co-extrusion molding hollow plate. The dimple-shaped honeycomb hollow plate is characterized in that an internal structure comprises an upper skin layer, a dimple-shaped honeycomb structure layer and a lower skin layer, wherein the dimple-shaped honeycomb structure layer is of an inlaid type sandwich structure in an up-and-down staggered mode. The dimple-shaped honeycomb hollow plate is provided, so as to overcome the defects of poor impact resistant performance, compressive deformation and infirmness of an existing plastic hollow plate, and the dimple-shaped honeycomb hollow plate has good performances of high strength, pressure resistance, wear resistance, heat insulation, impact resistance and breaking resistance, can simultaneously bear transverse section stress, longitudinal section stress and plate positive stress and has the advantages of uniform stress of each side surface, wide application range and good use effect.

Description

technical field [0001] The invention relates to a dimple-shaped honeycomb hollow board and its manufacturing method, which belongs to the manufacturing method of a multi-layer co-extrusion hollow board, in particular to a kind of extrusion through a three-layer co-extrusion machine, high-temperature hot air, hot pressing and hot melting. Dimple shape honeycomb hollow panel. Background technique [0002] At present, it is used in many fields such as turnover logistics equipment and plastic construction. Plastic hollow boards are more and more widely used. Plastic hollow boards are mainly extruded by plastic extruders and produced by vacuum shaping in hollow grid board molds. , but there are many restrictions on the application of these plastic hollow boards, basically they are mainly used in places where the weight of the goods is light or as a backing plate or a partition. It is composed of ribs, the strength is not high, not strong, the force is not strong, it is easy to b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B32B3/12B32B27/18B32B27/32B32B37/15B32B37/06B32B37/10
Inventor 周挺
Owner NINGBO TIANQI HONEYCOMB MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com