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Abrasive for polishing and manufacturing method of substrate using same

A technology for grinding materials and grinding processes, applied in chemical instruments and methods, manufacturing tools, grinding devices, etc., can solve problems such as variation, achieve excellent characteristics, excellent productivity, and improve the effect of grinding speed

Active Publication Date: 2017-10-27
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is known that there is usually a trade-off relationship between the surface roughness of the polished surface and the polishing speed, and as shown in Patent Document 2, if one is to be improved, the other tends to deteriorate, and it is difficult to achieve both.

Method used

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  • Abrasive for polishing and manufacturing method of substrate using same
  • Abrasive for polishing and manufacturing method of substrate using same
  • Abrasive for polishing and manufacturing method of substrate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 101、102、 comparative example 101、102

[0045] Preparation of abrasive material for polishing and composition for polishing

[0046] First, brown corundum and zircon sand are prepared and compounded, thereby preparing an abrasive material for polishing. The respective average particle diameters and compounding ratios are shown in Table 1. In addition, in order to confirm the variation of the experimental result, the abrasives for polishing of Comparative Examples 101a-101c and Comparative Examples 102a-102c were respectively prepared equivalent abrasives.

[0047] In the polishing test, 1400 g of water and 30 g of a commercially available polishing oil were mixed with 300 g of these abrasives, and dispersed with a mixer to prepare a polishing composition.

[0048] Polishing test

[0049] The polishing test was performed under the following conditions.

[0050] Silicon wafers with a diameter of 62.6 mm were selected as workpieces, and four of them were mounted in batches on a polishing machine (device name: 4B...

Embodiment 201、202、 comparative example 201、202

[0078] Evaluation of recycling characteristics

[0079] Evaluation of recycling characteristics was performed as follows. First, using the prepared polishing composition, polishing was performed according to the method described above. Thereafter, the entire amount of the used composition is recovered, and a new wafer is polished using the composition as it is. Then, the operation of recovering the composition and performing the next polishing process is further repeated.

[0080] Each composition was subjected to polishing processing 10 times, and the polishing rate and surface roughness at each stage were measured. The obtained results are shown in Table 2. In addition, about the composition used in Example 201,202, and comparative example 201,202, the composition of the same composition as Example 101,102, and comparative example 101,102 was used. In addition, the same evaluation experiment was performed twice about Examples 201 and 202.

[0081] [Table 2]

[0082] ...

Embodiment 301~303

[0083] Examples 301-303, Comparative Examples 301, 302

[0084] Preparation of abrasive material for polishing and composition for polishing

[0085] Brown corundum and zircon sand are prepared and compounded to prepare abrasive materials for polishing. The respective average particle diameters and compounding ratios are shown in Table 3. Next, 1400 g of water and 30 g of a commercially available polishing oil were mixed with 300 g of these abrasives, and dispersed with a mixer to prepare a polishing composition.

[0086] [table 3]

[0087]

[0088] Evaluation of recycling characteristics

[0089] The recycling characteristics were evaluated using the obtained polishing composition. During the evaluation, the polishing process was performed under the same conditions as in Example 201 except that the supply rate of the polishing composition was changed to 50 cc / min and the machining time was changed to 20 minutes.

[0090] The obtained results are shown in Table 4...

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Abstract

The present invention relates to an abrasive material for polishing whose polishing speed and surface roughness are improved at the same time, and a method for manufacturing a substrate using the same. Provided is an abrasive material for polishing and a method of manufacturing a substrate using the same to polish a substrate, the abrasive material comprising alumina particles having an average particle diameter of 3.5 μm or more and less than 11.5 μm and an average particle diameter of the aforementioned alumina material Zircon particles that are at least 0.2 times and less than 0.9 times the average particle size of the particles. Here, the content of the aforementioned zircon particles is not less than 1% by mass and less than 40% by mass based on the total mass of the abrasive.

Description

technical field [0001] The present invention relates to an abrasive for polishing used as abrasive grains in polishing. Background technique [0002] In recent years, along with the high integration and high speed of ULSI used in computers, the design rules of semiconductor devices have been miniaturized. Therefore, the depth of focus in the device manufacturing process becomes shallower, and the requirements for defect reduction and smoothness improvement required for semiconductor substrates become very strict. [0003] Therefore, it is required to obtain an extremely precise polished surface in the final finishing stage of the semiconductor element, but the method of polishing with the same precision as the finishing stage in the stage before the finishing stage is not preferable in terms of efficiency and cost. In addition, polishing pads are often used for polishing in the finishing stage, but if the polishing pads are used for long-term polishing, the edge portion of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/00B24B57/02H01L21/304
CPCC09K3/149C09K3/1463H01L21/02013
Inventor 横山英树大矢曜三伊藤润野杁真由美早川千寻
Owner FUJIMI INCORPORATED