Automated test equipment and automated test method for L3 circuit panels

Abstract

The invention discloses automated test equipment and an automated test method for L3 circuit panels, which relate to the field of function and performance testing of circuit panels of communication equipment. The automated test equipment comprises a test sub-rack, a network management platform and an integrated instrument; an automated test unit is arranged in the test sub-rack, and comprises a power module, a clock module, a field programmable gate array (FPGA) module, an individual panel management and control module, an Ethernet switch module and an interface circuit module; the power module is connected with the clock module, the FPGA module, the interface circuit module, the individual panel management and control module and the Ethernet switch module; the FPGA module is connected with the clock module, the interface circuit module, the individual panel management and control module and the Ethernet switch module; the individual panel management and control module is connected with the Ethernet switch module. The test equipment not only has high testing accuracy and testing efficiency, but also occupies less testing environment resources, can reduce the building cost and shorten the building process, and is convenient to use by people.

Description

technical field [0001] The invention relates to the field of function and performance testing of communication equipment circuit boards, in particular to an automatic testing device and method for an L3-layer circuit board. Background technique [0002] IPRAN (IP Radio Access Network Carrier, IP-based wireless backhaul bearer network) communication equipment is mainly used in the metropolitan area network. When IPRAN communication equipment is used, it is mainly based on base station backhaul, which can meet the routing solution for comprehensive service bearer. The core of IPRAN communication equipment is the L3 (network layer) layer circuit board. With the continuous development of optical communication, the L3 layer circuit board has been widely used in society. The test method used in the production test and verification test of the L3-layer circuit board is as follows: testers use the IPRAN functional sub-frame to build a complex point-to-point test platform, import cro...

AI Technical Summary

Problems solved by technology

The functional subrack is not only larger in size and power consumption, but also heavy in weight and occupies a large space, which in turn takes up a lot of test environment resources. When building a test platform (especially when building multiple sets of test platforms), it improves the test platform. The cost of construction prolongs the construction process of the test platform; it is not convenient for people to use for building multiple sets of test platforms

[0005] (2) The functional test items for the verification test and production test of the L3 layer line disk are: business connection test, clock function test, L3 layer static service test, LSP (Label Switched Path, label switching path) 1:1, Bfd (Bidirectional Forwarding Detection, bidirectional forwarding detection), OAM (Operation Administration and Maintenance, operation, management and maintenance), MCC (Management Communication Channel, management communication channel), S1 (synchronization status flag) and clock extraction, functional test items are relatively Many, when testing all functional test items, it is necessary to manually insert and insert optical fibers, switch the main and standby SCUO1 machine disks, and manually control the instrument to send and receive packets. The operation process is relatively complicated.

[0006] (3) The optical fiber connection of the existing test platform is relatively complicated, and the test time of a single machine disk is about 15 minutes, and the test efficiency is low

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