Directly water-cooled rectangular planar target structure

Abstract

The invention discloses a directly water-cooled rectangular planar target structure, which comprises a cooling pool, a magnetic assembly and a rectangular target, wherein the rectangular target is tightly arranged at an opening end of the cooling pool, the magnetic assembly is arranged in the cooling pool and can do reciprocating motion along the direction of a plane in which the rectangular target is; and a cathode electrode, a cooling water inlet pipe and a cooling water outlet pipe are arranged at the bottom end, far away from the opening end, of the cooling pool. The directly water-cooled rectangular planar target structure has the beneficial effects that the magnetic assembly does reciprocating motion in the cooling pool, so that a horizontal magnetic field is uniformly distributed on the target plane; and by adopting brand-new magnetic steel arrangement design, the range of the uniform magnetic field is extended to the outer side of the maximum translation position of the magnetic assembly, so that the uniform sputtering area is increased, and the effective utilization of a target material is improved. In addition, the cooling water is directly contacted with the target material, cooling is more direct, so that the heat conducting efficiency of the target material is improved, the power of the target material can be further enhanced, and the large-area uniform and fast deposited film can be realized.

Description

technical field [0001] The invention relates to a rectangular planar target, in particular to a direct water-cooled rectangular planar target structure, and belongs to the technical field of magnetron sputtering coating. Background technique [0002] The magnetron sputtering device has the advantages of fast coating rate, low temperature deposition, and no pollution, and has been widely used in various electronic and decorative coating fields. Among all kinds of target materials, the rectangular planar target is widely used because the target material is relatively easy to manufacture. However, in practical applications, the traditional rectangular planar target has two major defects. One is that the target and the magnetic assembly are fixed, resulting in the inability of the magnetic field to be uniformly distributed on the rectangular target surface, and V is prone to occur during sputtering etching. shaped etching groove, so that the utilization rate of the target is lo...

AI Technical Summary

Problems solved by technology

However, in practical applications, the traditional rectangular planar target has two major defects. One is that the target and the magnetic assembly are fixed, resulting in the inability of the magnetic field to be uniformly distributed on the rectangular target surface, and V is prone to occur during sputtering etching. shaped etching groove, so that the utilization rate of the target is low; the second is that the cooling of the target is indirect, that is, there is a metal layer between the target and the cooling water for electrical and thermal conduction, and for the metal layer and the The close contact between the targets also needs to be coated with a layer of heat-conducting silicone grease and other materials, which affects the cooling of the target, and then affects the increase in the power of the sputtering power applied to the target

The above defects affect the effective use area and target power of the target, so it is urgent to improve

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