Electronic component automatic testing device

Abstract

The embodiment of the invention provides an electronic component automatic testing method and device; the method is as follows: a to-be-tested electronic component is inserted onto a universal test socket array of an electronic switch tooling plate, precision position movement of an image acquisition module is driven by a mechanical arm movement platform, the image acquisition module is on the mechanical arm movement platform; when the image acquisition module reaches above a certain to-be-tested electronic component, a control circuit on the electronic switch tooling plate is started to work to control communication of the to-be-tested electronic component and the control circuit and an electrical performance measurement circuit on the electronic switch tooling plate by an electrical electronic switch matrix, and meanwhile the to-be-tested electronic component enters into the operation state; the image acquisition module photographs the to-be-tested electronic component in the position to acquire an appearance image of the to-be-tested electronic component and a light emitting image of a to-be-tested light emitting device, the acquired images are analyzed and processed by an image processing module in a main control module, a defect product is recognized; electrical performance of the to-be-tested electronic component in the position can be performed by the electrical performance measurement circuit, measured results are analyzed and processed by a measured result analysis module in the main control module, and the defect product is recognized.

Description

technical field [0001] The invention relates to the field of industrial automation, in particular to automatic testing of electronic components, industrial robots, image identification and electronic measurement. Background technique [0002] In the field of electronic component manufacturing, it is necessary to conduct batch production tests on the manufactured components to test the electrical performance, functional parameters, appearance, etc. of the components. It is also necessary to test the light performance parameters of the light emitting display device. [0003] Under the current technical situation, the front-end processes in the manufacturing process of electronic components, such as chip fixing, chip welding, etc., have been completed by automated machines, while the detection process of electronic components has a low degree of automation, especially for some fields. Electronic components or non-standard packaged electronic components. [0004] The main reas...

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problems of high manual dependence, low test efficiency and low test accuracy in the testing of electronic components, especially non-standard packaged electronic components

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