High-power laser module and packaging method thereof

A laser module, high-power technology, used in lasers, laser parts, semiconductor lasers, etc., to avoid power loss, reduce costs, and solve thermal stress problems

Inactive Publication Date: 2015-01-14
Shandong Huaguang Optoelectronics Co. Ltd.
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-power laser module packaged by the method of the present invention can not only effectively solve the problem of thermal accumulation between chips, but also provide a packaging form that replaces optical lenses and realizes the effect of slow axis compression

Method used

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  • High-power laser module and packaging method thereof
  • High-power laser module and packaging method thereof
  • High-power laser module and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] like Figure 1-3 shown.

[0047] A high-power laser module, including a heat sink 1, on the surface of the heat sink 1, and on the side of the light output end, a plurality of series-connected laser single-tube chip units are arranged, and the plurality of series-connected laser single-tube chip units The chip units are arranged in an arc shape on the side of the light output end of the heat sink.

[0048] A fast-axis compressed cylindrical lens 7 is arranged at the light-emitting end of the laser single-tube chip unit, and the light spot adjustment of the laser single-tube chip unit in the direction of the fast axis is realized through fast-axis compression.

[0049] The laser single-tube chip unit is fixedly connected to the heat sink 1 through the first solder; the laser single-tube chip unit includes a metallized ceramic substrate 5, and an insulating groove 6 and a laser single-tube chip unit are arranged on the metallized ceramic substrate 5. The chip 8, the las...

Embodiment 2

[0055] A high-power laser module as described in Embodiment 1, the difference is that, on the surface of the heat sink 1 and on the side of the light output end, there is a unit positioning groove 2 for installing a laser single-tube chip unit, and the unit The size of the positioning groove 2 is adapted to the size of the laser single tube chip unit.

Embodiment 3

[0057] like Figure 4 , 5 shown.

[0058] A high-power laser module as described in Embodiment 1, the difference is that the multiple series-connected laser single-tube chip units are arranged in an arc-shaped inscribed polyline on the side of the light-emitting end of the heat sink.

[0059] The light-emitting end surface of the heat sink is in the shape of an arc-shaped inscribed multi-segment line, and the shape and size of the light-emitting end face are adapted to the plurality of series-connected laser single-tube chip units arranged in an arc-shaped inscribed poly-segment line: The plurality of series-connected laser single-tube chip units are arranged along the arc-shaped inscribed multi-segment linear light-emitting end face.

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Abstract

The invention relates to a high-power laser module which comprises a heat sink. A plurality of laser single-tube chip units connected in series are arranged on the surface of the heat sink and one side of the light emitting end. The laser single-tube chip units connected in series are arranged on one side of the light emitting end of the heat sink in a circular arc or circular arc internally-tangent polyline mode. Due to the fact that high-power laser single tubes are connected in series, the high-power module is replaceable, and the heat effect caused by dense bars is avoided; the arc face design replaces a slow-axis compression lens, and therefore the laser power consumption is reduced.

Description

technical field [0001] The invention relates to a high-power laser module and a packaging method thereof, belonging to the technical field of semiconductor laser packaging. Background technique [0002] Due to the advantages of small size, light weight, high photoelectric conversion efficiency, long service life, and easy adjustment, semiconductor lasers are widely used in industrial, medical, communication, information display, and military fields. The research and development level of high-power semiconductor lasers has affected the development level of national defense technology and industry. Its application can mainly be used in the guidance and tracking of missiles, weapon simulation and bomb detonation, and night vision radar monitoring. The application of high-power bar laser can also be used in industrial metal cutting and engraving, metal melting and coating reprocessing. In the medical field, laser beauty is more and more popular. [0003] Semiconductor lasers a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024H01S5/00
Inventor 张骋孙素娟李沛旭汤庆敏
Owner Shandong Huaguang Optoelectronics Co. Ltd.
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