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Mask plate fixation device and method

A technology for fixing devices and reticles, which is applied in the field of photolithography, can solve problems such as residues, affecting the upper and lower plates of the reticle, and increasing the risk of damage to the reticle carrier, so as to achieve the effect of improving safety and reducing friction

Inactive Publication Date: 2015-02-11
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned patents did not solve another urgent problem in the industry: when the plate is loaded and unloaded, the plate holder releases the vacuum. Since the contact surface between the mask plate and the plate plate is very smooth, it is difficult to completely absorb the vacuum of the mask plate. released, there will be residual
In addition, there are van der Waals forces between the reticle and the plate, resulting in friction between the plate and the reticle
This friction will affect the loading and unloading of the reticle, and even increase the risk of damage to the reticle or plate holder during loading and unloading

Method used

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  • Mask plate fixation device and method

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Experimental program
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Effect test

Embodiment 1

[0042] see figure 1 , which is a schematic diagram of the structure of the photolithography device. It can be seen from the figure that the lithography apparatus mainly includes an illumination system 101 , a mask table 102 , a projection objective lens 103 , a workpiece table 104 , and a laser interferometer 105 . The illumination system 101 provides an exposure light source for the exposure device, the mask table 102 supports and positions the reticle through a mask fixing device (not shown), and the projection objective lens 103 provides an exposure field of view to expose the pattern on the reticle on the glass substrate. The workpiece table 104 carries glass substrates or silicon wafers, and provides support and positioning functions for the glass substrates or silicon wafers. Laser interferometer 105 provides position signals for precise motion control of the mask stage and workpiece stage.

[0043] see Figure 2A and Figure 2B ,in Figure 2A It is a schematic str...

Embodiment 2

[0047] see Figure 3A and Figure 3B ,in Figure 3A It is a schematic structural diagram of the mask fixing device in Embodiment 2 of the present invention (the vacuum is not turned on), Figure 3B It is a schematic structural diagram of the mask fixing device in Embodiment 2 of the present invention (after the vacuum is turned on). The difference between this embodiment and Embodiment 1 is that the flexible device includes a rigid pin 3051 and a flexible pad 3052, and the flexible pad 3052 passes through A coating or coating process is formed on the top of the rigid pin 3051 . The materials of the rigid columns 304 and the rigid pins 3051 are generally the same as those of the plate holder 302 , and they may be integrally processed with the vacuum chamber 306 through mechanical processing or other processes. The material of the flexible pad 3052 is generally a soft elastic material such as rubber, and the flexible material can be fixed on the rigid pin 3051 by coating or c...

Embodiment 3

[0049] see Figure 4A and Figure 4B ,in Figure 4A It is a schematic structural diagram of the mask fixing device in Embodiment 3 of the present invention (the vacuum is not turned on), Figure 4B It is a schematic structural diagram of the mask fixing device in Embodiment 3 of the present invention (after the vacuum is turned on). The difference between this embodiment and Embodiment 1 is: optional, the flexible device is a linear flexible wall 405, optional The flexible wall 405 is in an "S" shape, and the two ends of the flexible wall respectively abut against the bottom of the vacuum chamber and the lower surface of the reticle, that is, by fixing the flexible wall 405 in the plate vacuum chamber 406 A flexible device is thus formed. The flexible wall 405 is arranged between the two rigid columns 404 , and the upper surface of the rigid column 404 is coplanar with the mask adsorption surface 407 of the plate holder boss 403 , serving as the positioning surface of the r...

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Abstract

The invention discloses a mask plate fixation device and method. The device comprises a plate carrier platform having several bosses, a plurality of rigid columns and a plurality of flexible instruments. Each boss has a vacuum chamber, which is internally provided with the rigid columns and the flexible instruments. The upper surfaces of the rigid columns and mask adsorption surfaces of the bosses are coplanar. Before opening of vacuum, the upper surfaces of the flexible instruments are in a relaxed state higher than the mask adsorption surfaces, and after opening of vacuum, the upper surfaces of the flexible instruments are compressed by a mask plate to the height of the mask adsorption surfaces. According to the invention, by disposing the flexible instruments in the vacuum chambers, during loading and unloading of the mask plate, the vacuum between the mask plate and the plate carrier platform is completely released, the friction between the mask plate and the plate carrier platform is reduced, thereby improving the safety of the mask plate and the plate carrier platform during loading and unloading of the mask plate.

Description

technical field [0001] The invention relates to the field of photolithography, in particular to a mask plate fixing device and method. Background technique [0002] The photolithography apparatus in the prior art is mainly used in the field of integrated circuit IC or flat panel display and the manufacture of other micro devices. With a photolithographic apparatus, multilayer masks with different mask patterns are sequentially imaged in precise alignment on a photoresist-coated wafer, such as a semiconductor wafer or an LCD panel. Lithography devices are generally divided into two categories, one is a stepping lithography device, the mask pattern is exposed and imaged on one exposure area of ​​the wafer, and then the wafer moves relative to the mask to move the next exposure area to the mask pattern and under the projection objective, the mask pattern is again exposed on another exposed area of ​​the wafer, and the process is repeated until all exposed areas on the wafer ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
Inventor 江旭初
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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