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Dielectric material composition and its preparation method and use

A dielectric material and composition technology, applied in the field of dielectric material composition and its preparation, can solve the problems of no epoxy resin and polyphenylene ether, low cost, etc., achieve low cost, easy operation, excellent dielectric performance effect

Active Publication Date: 2016-10-26
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] A simple, effective, environmentally friendly and low-cost method for solving the compatibility problem of epoxy resin and polyphenylene ether has not been reported

Method used

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  • Dielectric material composition and its preparation method and use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] 80g bisphenol A epoxy resin (ESR618 (E-51), Nantong Xingchen Synthetic Material Co., Ltd. product), 20g bisphenol A epoxy resin (WSR6101 (E-44), Nantong Xingchen Synthetic Material Co., Ltd. product) Put it into a three-necked flask, heat to 150°C while stirring, add 28g of low molecular weight polyphenylene ether (MX90, number average molecular weight = 1700, Saudi Basic Industries Corporation), 14g of high molecular weight polyphenylene ether (number average molecular weight = 16785, Bluestar New Chemical Materials Co., Ltd. Ruicheng Branch product), after stirring for 1 hour, cool to 90°C, add 1 g of 2-ethyl-4-methylimidazole, continue stirring for 10 minutes to obtain an uncured semi-interpenetrating network Type epoxy resin / polyphenylene ether resin composition.

[0057] Pour the above epoxy resin / polyphenylene ether resin composition into a polytetrafluoroethylene mold, and then put it into an oven to cure. The curing process is: 80°C / 1 hour, 110°C / 3 hours, 150°C / 3 h...

Embodiment 2

[0059] Add 170g of toluene into a four-necked flask as a solvent. After heating to 90℃, dissolve 100g of high molecular weight polyphenylene ether (number average molecular weight = 16785, product of Bluestar New Chemical Material Co., Ltd. Ruicheng Branch) and 2.5g of bisphenol A, 20ml of a toluene solution of benzoyl peroxide (BPO) with a concentration of 0.125g / ml is added dropwise, the dropping time is 15 minutes, and the reaction is 4 hours after the dropping. After the reaction, the mixture was poured into a beaker, cooled to room temperature, precipitated with methanol and filtered, and then used Na 2 CO 3 Wash the product with an aqueous solution, dry the product and rinse it with methanol several times, and finally remove the solvent to obtain a low molecular weight hydroxyl-terminated polyphenylene ether with a number average molecular weight of 5327.

[0060] Add 100g of bisphenol A epoxy resin (ESR618(E-51), a product of Nantong Xingchen Synthetic Materials Co., Ltd.) ...

Embodiment 3

[0063] Add 170g of toluene into a four-necked flask as a solvent. After heating to 90℃, dissolve 100g of high molecular weight polyphenylene ether (number average molecular weight = 16785, product of Bluestar New Chemical Material Co., Ltd. Ruicheng Branch) and 2.5g of bisphenol A, 20ml of a toluene solution of BPO with a concentration of 0.125g / ml is added dropwise, the dropping time is 15 minutes, and the reaction is 4 hours after the dropping. After the reaction, the mixture was poured into a beaker, cooled to room temperature, precipitated with methanol and filtered, and then used Na 2 CO 3 Wash the product with an aqueous solution, dry the product and rinse it with methanol several times, and finally remove the solvent to obtain a low molecular weight hydroxyl-terminated polyphenylene ether with a number average molecular weight of 5327.

[0064] Add 100g of bisphenol A epoxy resin (ESR618(E-51), a product of Nantong Xingchen Synthetic Materials Co., Ltd.) into a three-necked...

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Abstract

The invention discloses a dielectric material composition which comprises the following components in parts by weight: 100 parts of epoxy resin, 10-40 parts of low molecular weight polyphenyl ether, 5-25 parts of high molecular weight polyphenyl ether and 1-5 parts of a solidification catalyst, wherein the number-average molecular weight of the low molecular weight polyphenyl ether is 1500-5500; the number-average molecular weight of the high molecular weight polyphenyl ether is 15000-20000. The dielectric material composition disclosed by the invention is relatively simple in component, a semi-interpenetration network structure is formed after the dielectric material composition is subjected to thermal solidification, the compatibility of polyphenyl ether and the epoxy resin is effectively improved, and the dielectric material composition has the excellent properties of low dielectric constant, low dielectric consumption, high thermal resistance and the like; in addition, a method for preparing the dielectric material composition disclosed by the invention is simple in process, simple and convenient to operate, relatively low in cost, particularly applicable to preparation of dielectric materials with high property, and has good application prospect.

Description

Technical field [0001] The invention relates to a dielectric material composition and a preparation method and application thereof, in particular to an epoxy resin / polyphenylene ether dielectric material composition and a preparation method and application thereof. Background technique [0002] Dielectric materials, also known as dielectrics, are electrical insulating materials and are widely used in capacitors, copper clad laminates, printed circuit boards and other fields. Generally, dielectric materials used in fields such as copper clad laminates and printed circuit boards need to have low dielectric constant and low dielectric loss as well as high heat resistance. [0003] Epoxy resin is widely used in copper clad laminates, printed circuit boards and other fields, such as FR-4 boards, due to its advantages in mechanical properties, processing properties, chemical solvent resistance, and low cost. However, the dielectric constant and dielectric loss of epoxy resin are relativ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L71/12C08G59/62H01B3/40H01B3/42
Inventor 刘鹏波林长红邹华维
Owner SICHUAN UNIV