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Metal nitride material for thermistor, method for producing same, and film type thermistor sensor

A thermistor and nitride technology, applied in the thermistor, metal material coating process, resistors and other directions, can solve the problem of lack of heat resistance, inability to ensure heat resistance, and thermal reliability of nitride materials Clear and other problems, to achieve the effect of good B constant and high heat resistance

Inactive Publication Date: 2015-02-25
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, in this thermistor material, in the example of Ta-Al-N-based material, although a material with a B constant of about 500 to 3000K was obtained, there is no description about heat resistance, and the nitride-based material Unclear thermal reliability
[0013] In addition, the Cr-N-M-based material of Patent Document 5 is a material with a small B constant of 500 or less, and if heat treatment at 200°C to 1000°C is not performed, heat resistance within 200°C cannot be ensured, so there is a problem that it cannot Problems in Realizing Thin Film Type Thermistor Sensors Formed Directly on Thin Films

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  • Metal nitride material for thermistor, method for producing same, and film type thermistor sensor
  • Metal nitride material for thermistor, method for producing same, and film type thermistor sensor
  • Metal nitride material for thermistor, method for producing same, and film type thermistor sensor

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Embodiment

[0113] Next, regarding the metal nitride material for thermistors and its manufacturing method and thin-film thermistor sensor according to the present invention, refer to Figure 8 to Figure 28 , and the results evaluated by the examples produced based on the above-mentioned embodiment will be specifically described.

[0114]

[0115] As examples and comparative examples of the present invention, the following Figure 8 Element 121 is shown for film evaluation. In addition, each of the following examples of the present invention was produced by using M=Ti, A=Sc and as (Ti 1-w sc w ) x al y N z The thermistor uses a metal nitride element, which is set as M=Ti, A=Zr and used as (Ti 1-w Zr w ) x al y N z The element of metal nitride for the thermistor is used as M=Ti, A=Mo and as (Ti 1-w Mo w ) x al y N z The metal nitride element for the thermistor is used as M=Ti, A=Nb and as (Ti 1-w Nb w ) x al y N z The thermistor uses a metal nitride element, which is ...

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Abstract

Provided are a metal nitride material for a thermistor, which has a high reliability and high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: (M1-wAw)xAlyNz (where “M” represents at least one of Ti, V, Cr, Mn, Fe, and Co, “A” represents at least one of Sc, Zr, Mo, Nb, and W, 0.0<w<1.0, 0.70≰y / (x+y)≰0.98, 0.4≰z≰0.5, and x+y+z=1), wherein the crystal structure thereof is a hexagonal wurtzite-type single phase.

Description

technical field [0001] The present invention relates to a metal nitride material for a thermistor that can be directly formed on a thin film or the like under non-firing conditions, a manufacturing method thereof, and a thin film type thermistor sensor. Background technique [0002] Thermistor materials used in temperature sensors etc. require a high B constant for high precision and high sensitivity. Conventionally, such thermistor materials are generally transition metal oxides such as Mn, Co, and Fe (refer to Patent Documents 1 to 3). In addition, these thermistor materials require heat treatment such as firing at 550° C. or higher in order to obtain stable thermistor characteristics. [0003] And, in addition to the thermistor material composed of the above-mentioned metal oxide, for example, in Patent Document 4, it is proposed that the general formula: M x A y N z (Wherein, M represents at least one of Ta, Nb, Cr, Ti and Zr, and A represents at least one of Al, Si ...

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Application Information

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IPC IPC(8): H01C7/04
CPCC30B33/04C30B25/06H01C7/008C30B29/38C23C14/0641C23C14/5826C23C14/586H01C7/041
Inventor 藤田利晃田中宽长友宪昭
Owner MITSUBISHI MATERIALS CORP
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