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wavelength conversion device

A wavelength conversion device and wavelength conversion technology, applied in projection devices, lighting devices, components of lighting devices, etc., can solve problems such as inability to obtain heat dissipation effects, reduced conversion efficiency of wavelength conversion components, and inability to obtain light output, etc.

Active Publication Date: 2017-07-28
NICHIA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the light source device described in Patent Document 1, the heat of the phosphor layer can only be dissipated from the bottom surface, and a sufficient heat dissipation effect cannot be obtained.
Therefore, there is a problem that the conversion efficiency of the wavelength conversion member is lowered, and the desired light output cannot be obtained.

Method used

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Experimental program
Comparison scheme
Effect test

no. 1 approach >

[0025] figure 1 The wavelength conversion device 100 of this embodiment is shown. The wavelength conversion device 100 includes a heat sink 50 , a wavelength conversion member 10 provided on the heat sink 50 , and a connecting member 40 made of a metal material and connecting the heat sink 50 and the wavelength conversion member 10 . In particular, the wavelength conversion member 10 has an upper surface, side surfaces and a lower surface, and the connection member 40 is thermally connected to the side surfaces and the lower surface of the wavelength conversion member 10 .

[0026] Thereby, deterioration of the wavelength conversion member 10 can be suppressed. This is because the connection member 40 is thermally connected not only to the bottom surface but also to the side surface, so that heat dissipation paths can be increased.

[0027] Here, in this specification, for convenience of description, the lower side of the illustrated cross-sectional view is expressed as "lo...

no. 2 approach >

[0068] As a mode different from the wavelength conversion device 100, it is also possible to adopt image 3 The configuration of the wavelength conversion device 200 shown is the same. The wavelength conversion device 200 has a third reflective film 23 made of a dielectric multilayer film between the first reflective film 21 and the second reflective film 22 described in the first embodiment. The third reflective film 23 can mainly reflect light incident in a vertical direction with respect to the first reflective film 21 . In this configuration, although the reflectance is improved by the dielectric multilayer film, the heat dissipation is reduced. However, in the present invention, since the connection member is provided not only on the lower surface but also on the side surface, a certain effect can be expected.

[0069] As the dielectric multilayer film, two or more layers having different refractive indices among the materials of the dielectric film in which the first r...

Embodiment 1

[0071] based on figure 1 The wavelength conversion device of this embodiment will be described. First, a wafer-shaped wavelength conversion member obtained by sintering a support made of powdery LAG-based phosphor and powdery alumina by the SPS method was prepared. On the upper surface of the wafer-shaped wavelength conversion member, a protective film made of silicon oxide (film thickness 100 nm) is formed by sputtering, and a protective film made of silicon oxide (film thickness 100 nm) is formed by sputtering in order from the wavelength conversion member side on the lower surface of the wavelength conversion member. The first reflective film made of aluminum (film thickness 1000 nm), and the second reflective film made of silver (film thickness 1000 nm).

[0072] Next, using a bevel dicing blade, dicing was performed so that the side surface of the wavelength conversion member spread from the bottom to the top. At this time, the inclination angle (the angle formed by th...

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PUM

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Abstract

An object of the present invention is to provide a wavelength conversion device capable of efficiently dissipating heat from a wavelength conversion component to a heat dissipation component. The wavelength conversion device of the present invention includes a heat dissipation member, a wavelength conversion member provided on the heat dissipation member, and a connection member that connects the heat dissipation member and the wavelength conversion member. In particular, the wavelength conversion component has an upper surface, a side surface and a lower surface, and the connecting component is thermally connected to the side surface and the lower surface of the wavelength conversion component.

Description

technical field [0001] The present invention relates to a wavelength conversion device that can be used in a projector or the like. Background technique [0002] The light source device described in Patent Document 1 includes a solid light source that emits light as excitation light, a phosphor layer containing at least one kind of fluorescent light, and a heat dissipation substrate. The phosphor layer is bonded to the heat dissipation substrate through a joint (for example, see figure 2 ). Furthermore, the heat from the phosphor layer is diffused to the heat dissipation substrate through the bonding portion. [0003] Patent Document 1: (Japanese) Unexamined Patent Application Publication No. 2012-15001 [0004] However, in the light source device described in Patent Document 1, the heat of the phosphor layer can only be dissipated from the bottom surface, and a sufficient heat dissipation effect cannot be obtained. Thus, there is a problem that the conversion efficiency ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S2/00F21V7/00F21V7/22F21V29/50H01L33/50F21Y115/10F21V9/40
CPCG03B21/204H01L33/505H01L33/507H01L33/644F21V7/26G03B21/16Y10T29/49828F21V13/08F21V29/502G02B5/0858H01L33/60
Inventor 川真田润小杉卓生
Owner NICHIA CORP