Anti-blackening silver colloid

Abstract

The invention relates to conductive silver colloid. The silver colloid comprises silver powder and bisphenol A epoxy resin and also comprises at least one of the following substances which account for 0.05-0.2wt% of the total weight of the silver colloid: 2,2-oxamide-bis[ethyl-3-(3,5-bitertiary butyl-4-hydroxyl phenyl)] propionate, an antioxidant 1024, vinyl bi(oxyvinyl)bis[3(5-tertiary butyl-4-hydroxyl-m-methylphenyl) propionate], 2,2'-sulfo-diethyl bis[3-(3,5-bitertiary butyl-4-hydroxyphenyl) propionate], N, N'-1,6-hexylidene-bis-(3,5-bitertiary butyl-4-hydroxyl fenalamide) and ethylene glycol-bis-(2-aminoethylether)-N,N,N',N'-tetraacetic acid. The substances are added into the silver colloid, element S is preferably fixed when H2S is dispersed on the surface of silver so as to prevent reaction between S and Ag, so that the silver colloid has an anti-blackening property.

Description

technical field [0001] The invention relates to a conductive silver glue. Background technique [0002] At present, conductive silver glue has been widely used as a substitute for solder such as Sn-Pb, Sn-Pb-Bi, and Sn-Pb-Ag. The main reason is that the use temperature of these solders is generally higher than 300°C, and many electronic devices cannot withstand such a high temperature, so silver glue cured below 200°C came into being. However, silver glue also has its own problems. For example, it is easy to react with O2 and H2O in the air to reduce conductivity and cohesion. National starch patent CN1555563A discloses a conductive material with electrical stability, specifically referring to conductive glue, especially silver glue. Adding N-hydroxysuccinimide, benzotriazole, thiaphenazine and other substances to inhibit the aging of silver glue and increase its resistance stability. The patent claims that these additives can inhibit the electrochemical oxidation of silver...

AI Technical Summary

Problems solved by technology

However, silver glue also has its own problems. For example, it is easy to react with O2 and H2O in the air to reduce conductivity and cohesion. National starch patent CN1555563A discloses a conductive material with electrical stability, specifically referring to conductive glue, especially silver glue. Adding N-hydroxysuccinimide, benzotriazole, thiaphenazine and other substances to inhibit the aging of silver glue and increase its resistance stability. The patent claims that these additives can inhibit the electrochemical oxidation of silver glue and copper substrate so as to achieve its purpose

Images