Gold finger manufacturing method for reducing oxidation of gold finger

A production method and technology of gold fingers, which are applied in printed circuit manufacturing, cleaning/polishing of conductive patterns, secondary processing of printed circuits, etc., can solve the problems of gold finger doping, gold finger oxidation, etc. The generation of copper dust and the effect of reducing waste

Active Publication Date: 2015-03-04
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at introducing copper ions into the gold cylinder easily in the existing gold finger manufacturing method, resulting in copper doping in the prepared gold finger, and copper dust is easy

Method used

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  • Gold finger manufacturing method for reducing oxidation of gold finger
  • Gold finger manufacturing method for reducing oxidation of gold finger

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Embodiment 1

[0020] This embodiment provides a gold finger manufacturing method for reducing gold finger oxidation, which specifically includes the following steps:

[0021] (1) Production of circuit boards (outer circuit and solder resist layer were produced on the multi-layer board)

[0022] First, as in the circuit board production process of the prior art, the raw materials of each layer of circuit board are cut to obtain the substrate, and then the inner layer pattern is transferred to each substrate to form the inner layer circuit circuit, and then the circuit boards of each layer are laminated to form Multi-layer circuit board, and then drill the multi-layer circuit board. After drilling, place the multi-layer circuit board in the electroplating tank for copper sinking treatment and full-board electroplating treatment. Then carry out outer layer pattern transfer, pattern electroplating, film stripping, etching and tin stripping in sequence, so that the outer layer circuit lines are ...

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PUM

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Abstract

The invention relates to the technical field of production of circuit boards, and particularly relates to a gold finger manufacturing method for reducing oxidation of the gold finger. a combined board cleaning method, that is, pickling, pressurized water cleaning, ultrasonic immersion cleaning and water-column type flushing, is used in the gold finger electroplating post-processing process, a physical polishing process such as board polishing and sand blasting in the prior gold finger electroplating post-processing process is replaced, generation of copper dust can be avoided, and the problem that the copper dust is attached to the surface of the gold finger to enable the gold finger to be likely to oxidize can be avoided. a conductive brush is arranged above a gold tank, the conductive brush is separated from the gold tank and is far away from the gold tank, medicinal liquid inside the gold tank can be prevented from corrode the conductive brush, and the possibility that copper wires on the conductive brush fall in the gold tank can thus be reduced. A receiving disc is arranged below the conductive brush for receiving the copper wires falling from the conductive brush, falling copper wires can be further prevented from dropping in the gold tank, random falling can be prevented, and cleaning and maintaining are facilitated.

Description

technical field [0001] The invention relates to the technical field of gold finger production, in particular to a gold finger production method for reducing gold finger oxidation. Background technique [0002] Gold finger circuit board is a circuit board with gold fingers. After the previous process, nickel / gold is electroplated on the gold finger to form a finger-shaped gold solder that can be used for plugging. plate. Gold fingers have good wear resistance and low contact resistance, which can meet the requirements of multiple plugging and unplugging. In the existing circuit board production technology, gold fingers are usually produced in the surface treatment process after the outer circuit and the solder resist layer are produced. Gold fingers are prone to be oxidized in the process of making gold fingers, and there are many factors that cause gold fingers to be oxidized. Copper dust is produced during the process and adheres to the surface of the gold finger, and th...

Claims

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Application Information

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IPC IPC(8): H05K3/22
CPCH05K3/26H05K2203/0766H05K2203/0789H05K2203/14
Inventor 韩焱林朱拓姜雪飞田小刚
Owner SHENZHEN SUNTAK MULTILAYER PCB
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