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Polishing composition and fabrication method of substrate using same

A technology of composition and metal compound, which is applied in the direction of polishing composition containing abrasives, manufacturing tools, grinding devices, etc., can solve the problems of rising grinding costs, surface defects, orange peel, etc., and achieve the effect of suppressing surface defects

Active Publication Date: 2015-03-04
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that the use of high concentration of colloidal silica will increase the grinding cost
In addition, when the amount of colloidal silica used is reduced in order to reduce costs, there is a problem that surface defects such as orange peel occur.

Method used

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  • Polishing composition and fabrication method of substrate using same
  • Polishing composition and fabrication method of substrate using same
  • Polishing composition and fabrication method of substrate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0071] Next, examples and comparative examples are given to describe the above-mentioned embodiment in more detail.

[0072] (Preparation of Polishing Composition)

[0073] A colloidal silica sol containing colloidal silica having an average primary particle diameter of 80 nm was diluted with water, and various surface adsorbents were added thereto. Then, the pH was adjusted to 7 using nitric acid or potassium hydroxide (pH adjuster), thereby preparing polishing compositions of Examples 1 to 6 and Comparative Example 1. The types and weight-average molecular weights of the surface adsorbent contained in each polishing composition are shown in the "Surface Adsorbent" column of Table 1. In the polishing compositions of Examples 1 to 6, the colloidal silica content was 5% by mass and the surface adsorbent content was 0.032% by mass.

[0074] A colloidal silica sol containing colloidal silica having an average primary particle diameter of 80 nm was diluted with water, and its pH...

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Abstract

In the present invention, a polishing composition contains abrasive particles, a surface adsorption agent, and water and is used to polish a polishing target comprising crystalline metallic compounds. Compared to the case where the surface adsorption agent is removed from the polishing composition, the polishing composition reduces the surface defects of the polishing target after polishing.

Description

technical field [0001] The present invention relates to a polishing composition used for polishing an object to be polished made of a crystalline metal compound and a method for producing a substrate using the same. Background technique [0002] As substrate materials for optical devices and substrate materials for power devices, oxides such as aluminum oxide (such as sapphire), silicon oxide, gallium oxide, and zirconia, and nitrides such as aluminum nitride, silicon nitride, and gallium nitride are known. carbides, and carbides such as silicon carbide. Substrates or films formed from these materials are generally stable against chemical actions such as oxidation, complexation, etch, so grinding-based processing is not easy. Therefore, it is usually processing based on grinding and cutting using hard materials. However, a surface with high smoothness cannot be obtained in processing by grinding and cutting. [0003] Hitherto, it has been known to polish a sapphire substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00C09G1/02C09K3/14H01L21/304
CPCC09G1/02B24B37/044C09K3/1409C09K3/1436C09K3/1463
Inventor 谷口惠森永均芹川雅之
Owner FUJIMI INCORPORATED
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