load cell

Abstract

The invention provides a force measuring sensor, which includes a pressure head, a base, a sensitive element, a circuit board seat, a lead wire fixing circuit board, a multifunctional circuit board, a lead wire, a conductive column, a wire and a shell. The circuit board seat is made of stainless steel, and it is copper-plated or gold-plated. It is welded on the sensitive element by laser welding or electron beam welding. The lead wire is fixed. The circuit board is directly welded and fixed on the other side of the circuit board seat by solder or high-temperature solder. The fixed circuit board and the multi-function circuit board are connected and fixed through conductive posts. The invention can be used in extremely harsh working environments such as ultra-high or ultra-low temperature, severe impact, vibration, etc., and can solve the problem of high-precision force measurement in special environments requiring no organic matter and various adhesive structures. It has very practical significance for solving high-precision force measurement problems in complex industrial environments, military equipment, and aerospace and navigation environments.

Description

technical field [0001] The invention relates to a force measuring sensor, in particular to a sputtering thin film force measuring sensor suitable for extremely harsh working environments such as ultra-high / ultra-low temperature, severe impact and vibration. Background technique [0002] Force sensors are widely used in various fields such as industrial production, military equipment, aerospace and navigation. Although the existing force sensors have various structures, they all more or less need to be glued together. For example, the conversion of the force signal to the electrical signal is realized by pasting the resistance strain gauge on the sensitive element; another example, the lead wires drawn from the strain gauge also need to be fixed on the circuit board or the lead terminal, and in order to save space as much as possible and reduce the complexity of the structure Sex, the fixing method is also often glued. Although the bonding process is widely used, it has man...

AI Technical Summary

Problems solved by technology

In some vacuum environments, some types of glue also have potential risks such as decomposition and escape.

In addition, the bonded structure is prone to aging and corrosion in some industrial environments, which greatly reduces the performance and life of the sensor

In aerospace exploration activities, sensors that are directly in contact with the space environment must be able to withstand special requirements such as high vibration, high impact, ultra-high vacuum environment, and large temperature difference. The adhesive structure has yet to be fully verified, and metal materials, PCB circuits board (commonly used materials are epoxy substrates, but there are already mature inorganic substrates) and processing technology, but the welding process has been fully verified in previous aerospace exploration activities

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