Flexible electronic fluid encapsulation method capable of improving ductility

A packaging method and a ductile technology, applied in the direction of decorative arts, microstructure devices, processing microstructure devices, etc., can solve the difficulty of ensuring the deformation mode of the interconnection structure, the constraints of the tensile capacity of the interconnection structure, and the performance of the packaging structure needs to be improved, etc. problems, to achieve the effect of improving work stability, good support, and good tensile properties

Active Publication Date: 2015-03-25
HUAZHONG UNIV OF SCI & TECH
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Problems solved by technology

The problem with this method is that the incompatibility of the flexible interconnect structure with the adhesive layer and the substrate will affect the tensile properties of the interconnect structure, and during the stretching process, the stretchability of the interconnect structure is affected by the adhesive. Adhesive layer and substrate bound and not fully applied
[0004] However, further studies have shown that the above existing technologies still have the following problems: 1) the interconnec

Method used

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  • Flexible electronic fluid encapsulation method capable of improving ductility
  • Flexible electronic fluid encapsulation method capable of improving ductility
  • Flexible electronic fluid encapsulation method capable of improving ductility

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[0028] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0029] figure 1 It is used to show the flow diagram of the fluid encapsulation process of the present invention. Refer to below figure 1 To explain the specific operation process in detail.

[0030] First, according to the structure of the microcavity, a mold with the corresponding structure can be designed and prepared, such as figure 1 As shown in the figure, the Ecoflex solution is configured, the po...

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Abstract

The invention discloses a flexible electronic fluid encapsulation method capable of improving ductility. The flexible electronic fluid encapsulation method comprises the following steps: preparing an upper encapsulation structure and a lower encapsulation structure, wherein the two encapsulation structures are symmetrical and areas concavely extending are formed in central parts of the encapsulation structures; manufacturing a ductility interconnection structure which is of a curve structure with overall wavy distribution; correspondingly laminating the upper encapsulation structure and the lower encapsulation structure, and encapsulating the ductility interconnection structure in a hollow micro cavity; and finally, injecting insulation fluid into the micro cavity so that the micro cavity is filled with the insulation fluid and the ductility interconnection structure is coated, and therefore, the overall fluid encapsulation operation is completed. By virtue of the flexible electronic fluid encapsulation method capable of improving ductility, the tensile property of the interconnection structure can be remarkably improved; the phenomenon that the surface warps outwards is avoided; the quality can be controlled; meanwhile, the stability of the interconnection structure can be effectively improved.

Description

technical field [0001] The invention belongs to the technical field of flexible electronics manufacturing, and more specifically relates to a flexible electronic fluid packaging method that can improve ductility. Background technique [0002] Flexible electronics is an emerging electronic technology that manufactures electronic devices on flexible or ductile plastic or thin metal substrates. , national defense and many other fields have broad application prospects. At present, for the flexible electronic interconnection structure, the preparation process adopted is mainly to use the printing method to directly print the flexible interconnection structure on the elastic substrate, and fix it with the elastic substrate through the adhesive layer. The problem with this method is that the incompatibility of the flexible interconnect structure with the adhesive layer and the substrate will affect the tensile properties of the interconnect structure, and during the stretching pro...

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Application Information

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IPC IPC(8): B81C3/00B81C1/00
Inventor 黄永安王曳舟董文涛黄涛
Owner HUAZHONG UNIV OF SCI & TECH
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