Method for increasing balling rate of metal convex block in vacuum backflow technology
A technology of vacuum reflow and metal bumps, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problem of low ball forming rate, and achieve the effect of improving roughness and improving low ball forming rate
Active Publication Date: 2015-04-01
NANTONG FUJITSU MICROELECTRONICS
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Abstract
The invention provides a method for increasing the balling rate of a metal convex block in a vacuum backflow technology in the field of semiconductor encapsulation. The method specifically comprises the following steps: (1) allowing a spherical or square metal welding flux convex block to form on a UBM (under bump metal); (2) cleaning the metal welding flux convex block prepared in the step (1) by a hairbrush; (3) putting the metal welding flux convex block treated in the step (2) into a vacuum backflow furnace for backflow; (4) cooling the metal convex block subjected to backflow in the step (3) to the temperature lower than 40 DEG C under a vacuum condition. According to the method disclosed by the invention, the problem of low balling rate of the metal convex block in the vacuum backflow technology can be solved, and the balling rate is increased from 99.5 to 99.98 percent; meanwhile, the surface roughness of a balled metal convex block is also effectively improved.
Application Domain
Solid-state devicesSemiconductor/solid-state device manufacturing +1
Technology Topic
BackflowMetal +2
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PUM
Property | Measurement | Unit |
Granularity | 180.0 ~ 2000.0 | mesh |
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