A thermal arrayed waveguide grating wavelength division multiplexer and its manufacturing method

Abstract

The invention discloses an athermal array waveguide grating wavelength division multiplexer and a manufacturing method thereof. It includes an AWG chip, an interlayer, a base plate, and a temperature compensation device. The interlayer adopts a first interlayer and a second interlayer whose expansion coefficient is the same as or close to that of the AWG chip. In the interlayer, the input waveguide, input planar waveguide and part of the output planar waveguide of the AWG chip are fixed on the first interlayer, and the output waveguide of the AWG chip is fixed on the second interlayer; the AWG chip is divided into the first chip, the second chip and the second interlayer along the slit direction. The chip divides the first interlayer into a first part and a second part; the first part of the first interlayer is fixed with the base plate using an adhesive that can achieve thermal expansion and movement, and the second part of the first interlayer and the second interlayer are on the same base plate. The surface is fixed and bonded; one end of the temperature compensation device is fixed on the first chip or the upper surface of the first part of the first interlayer, and the other end is fixed on the upper surface of the second interlayer; the method and device of the present invention have simple structure and high wavelength stability. low cost.

Description

technical field [0001] The invention relates to an athermal array waveguide grating wavelength division multiplexer and a manufacturing method thereof (athermal AWG), which belongs to the communication field. Background technique [0002] Arrayed waveguide gratings (AWG Arrayed Waveguide Gratings) are the most ideal devices for realizing multi-channel dense wavelength division multiplexing (DWDM Dense Wavelength Division Multiplexing) optical networks. In 1988, Smit of Delft University in the Netherlands first proposed the concept of AWG. Its basic function is to combine / demultiplex wavelengths. With its advantages of large number of channels, small size, easy integration with other devices, and low price, it has replaced the traditional The dense wavelength division multiplexing / demultiplexing device of TFF has been widely used in backbone network and metropolitan area network for many years; in addition, AWG can flexibly form multifunctional devices and modules with other ...

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Problems solved by technology

[0005] The current schemes have the following problems: 1. Single-layer chip structure is adopted, which requires less material and simple structure, but it is usually made of square chips, which is expensive for AWG chips that have been in commercial use for many years.

2. With a double-layer board structure, the chip itself is very sensitive to stress, and it is difficult to achieve a balance between stable wavelength and spectral deformation caused by stress, resulting in low yield

3. Use offset suppression components (such as spring clips) to place in the moving structure to ensure the stability of the work by reducing the influence of the glue layer on the flatness, but in the actual process, additional components will bring uncertainty influence, and will lead to irregular changes in wavelength under high and low temperature conditions

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