Method for enhancing reliability of aluminium wire bonding solder joints

A reliability and solder joint technology, which is applied in the manufacturing of electrical components, electric solid state devices, semiconductor/solid state devices, etc., can solve the problem of no substantial improvement in the reliability of solder joint connections, and achieve high production efficiency and improved reliability. Effect

Inactive Publication Date: 2015-04-08
NANTONG HUADA MICROELECTRONICS GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this invention, the structure-assisted bonding process of energy-conducting ribs is used. Although it is beneficial to the positioning of the device, it does not substantially improve the reliability of the solder joint connection between the aluminum wire and the frame.

Method used

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  • Method for enhancing reliability of aluminium wire bonding solder joints

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Embodiment Construction

[0022] Such as figure 1 In the shown device welded by the method of strengthening the reliability of aluminum wire bonding solder joints, the aluminum wire 1 and the copper lead frame 5 have a first solder joint 2 and a second solder joint 3, and the second solder joint 3 adopts Welded by the following sequence of processes:

[0023] 1) Use a short-nosed rivet welding jig that is shorter than the mouth of the rivet for the first solder joint 2;

[0024] 2) Determine that the starting position of the second welding spot 3 is the wire diameter of the aluminum wire 1 about 3 times away from the first welding spot 2;

[0025] 3) Control the lifting height of the short-nosed riving knife during the movement, so that the lifting height is more than 2 times to 5 times the wire diameter;

[0026] 4) Keeping in the extension direction of the line segment of the first soldering point 2, the aluminum wire 1 and the copper lead frame 5 are ultrasonically welded to the second soldering p...

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Abstract

The invention discloses a method for enhancing reliability of aluminium wire bonding solder joints and is applied in soldering operation of an aluminium wire and copper lead frame. A second solder joint is additionally soldered on a traditional first solder joint, and adopts a short-mouth chopper with a mouth part being shorter than that of mouth part of a chopper for the first solder joint; the initial position of the second solder joint is the wire diameter of the aluminium wire which is 2 times to 4 times of the distance away from the first solder joint; the total length of the second solder joint is greater than the length of the first solder joint, and then the tail part of the aluminium wire is cut by a cutter. According to the method, the reliability of electrical connection of microelectronic devices is improved, and the continuous soldering operation can be realized.

Description

technical field [0001] The present invention relates to wire bonding technology in the microelectronics industry. Background technique [0002] In the microelectronics industry, aluminum wires need to be used as semiconductor electrode leads and welded together with copper lead frames, referred to as bonding. [0003] Ultrasonic welding is usually used for bonding operations, that is, ultrasonic generators are used to generate ultrasonic waves, high-frequency vibrations are generated by transducers, and transmitted to welding tools (choppers) through horns. When the chopper is in contact with the lead wire (aluminum wire) and the part to be welded (copper lead frame), under the action of pressure and vibration, the surfaces of the two metals to be welded rub against each other, the oxide film is destroyed, and plastic deformation occurs, resulting in two The pure metal surfaces are in close contact, and the bonding at atomic distance produces a strong mechanical connection...

Claims

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Application Information

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IPC IPC(8): H01L21/60
CPCH01L2224/45124H01L2224/48247H01L2224/4846H01L2924/15747H01L23/488H01L24/02H01L24/03H01L24/04H01L2224/02H01L2224/03H01L2224/04
Inventor 储新建陈峰姚鸿林
Owner NANTONG HUADA MICROELECTRONICS GROUP
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