Process method for integrated circuit carrying plate plug hole

Abstract

The invention provides a process method for an integrated circuit carrying plate plug hole. The process method for the integrated circuit carrying plate plug hole comprises the following steps that an aluminum screen printing plate is manufactured, and a specific through hole of the integrated circuit carrying plate is subjected to ink hole plugging; a leveling machine is used for leveling excessive ink outside the through hole; a drying machine completely dries ink on the integrated circuit carrying plate; the ink on the surface of the through hole is subjected to exposure development; an alkaline solution is used for removing uncured dry film protection ink on the carrying plate around the through hole; a demolding agent is used for removing a dry film cured on the surface of the plug hole; the ink projected out of the through hole and projected at the edge of the through hole are ground away by a plate grinding machine, so that the surface of the ink inside the through hole is aligned with the surface of the integrated circuit carrying plate. The process method for the integrated circuit carrying plate plug hole provided by the invention has the advantages that the operation is simple and convenient, the recessed phenomenon of the ink in the through hole can be avoided, the flatness of the surface of a product is ensured, and the output rate of inferior-quality products and the loss due to the reason are reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a process method for plugging holes of an integrated circuit (Integrated Circuit, IC) carrier board. Background technique [0002] IC substrate is one of the main components of electronic information products. Its production process is relatively complicated and cumbersome, one of which is to fill the holes on the IC substrate with ink. The diameter of the hole on the IC substrate is very small, and fine operations often have high requirements for precision. However, in the actual production process, due to the solvent contained in the ink, the ink often solidifies and shrinks after drying, resulting in The ink is sunken at the hole, and the hole cannot be completely filled. This will cause tin residue in the hole and cannot be kept clean during subsequent processes such as tin spraying, and will have a great impact on its appearance and packaging. Make the IC s...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above-mentioned technical problem that ink surface sags are prone to occur during the processing of the above-mentioned IC carrier plug holes, resulting in a high product defective rate, the present invention provides a method that can avoid ink sags to ensure product surface smoothness and greatly reduce product defective rate. Process method of IC substrate plug hole

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