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Novel three-dimensional reconstruction system

A new type of three-dimensional reconstruction technology, applied in the field of structural dust physics, can solve problems such as the inability to achieve seamless correlation and high-speed transmission, and achieve the effect of reducing work intensity and improving research efficiency.

Inactive Publication Date: 2015-04-22
TSINGHUA UNIV
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Problems solved by technology

[0012] But at present, in terms of 3D reconstruction of dust electron microscope, there is no related technology that combines LSF system, Appion system, and cryo-electron microscope for 3D reconstruction, and there is no effective technical means to achieve effective communication between the two. That is, seamless association and high-speed transmission cannot be achieved

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Embodiment Construction

[0029] Such as figure 1 As shown, a new three-dimensional reconstruction system described in the present invention includes a workflow display module of the Appion system, a data instruction conversion module, a data configuration module, a grid job queue module of the LSF system, a scheduling library module of the LSF system, and a LSF system Billing library module and network resource pool module. in:

[0030] The workflow display module of the Appion system mainly realizes the workflow interface display, and is used for setting the parameters of the Appion system simultaneously;

[0031] The data instruction conversion module mainly realizes that the data processing operation instruction of the Appion system is converted into the LSF system queue task model;

[0032] The data configuration module mainly completes the specific setting of the docking environment of the Appion system and the LSF system, mainly including user settings, job queue settings, and connection attri...

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Abstract

A novel three-dimensional reconstruction system comprises a workflow presenting module of an Appion system, a data instruction conversion module, a data configuration module, a grid job queue module of an LSF system, an LSF scheduling library module, an LSF billing library module and a network resource pool module. The novel system based on the LSF system, the Appion system and a cryo-electron microscopy technology achieves three-dimensional reconstruction. The system ingeniously and organically combines the Appion system, a cryo-electron microscopy biological structure research technology and a grid calculation technology based on an LSF, and forms a novel cryo-electron microscopy three-dimensional reconstruction technology. The technology is mainly characterized by achieving a three-dimensional reconstruction assembly line technology, and the assembly line technology can effectively reduce work intensity of electron microscopic image analysis of biologic samples and effectively improve research efficiency of an electron microscopy three-dimensional reconstruction method in structural biology.

Description

technical field [0001] The technology belongs to the field of structural dust, and specifically relates to a cryo-electron microscope based on an LSF system and an Appion system to realize a three-dimensional reconstruction pipeline system. Background technique [0002] Cryo-Electron Microscopy (Cryo-EM for short) was founded in 1974 by Taylor K and Glaeser RM. Cryo-EM is an emerging three-dimensional reconstruction method of dust macromolecules, and it is also a typical multidisciplinary comprehensive technology, including electron microscopy, imaging technology, computer three-dimensional reconstruction technology and bioinformatics technology. [0003] The main idea of ​​Cryo-EM is to use cryo-electron microscopy and low-dose electron beam imaging technology to electronically image samples, use high-sensitivity film for imaging records, and perform image processing on recorded images, including dust molecular particle identification, correction, and denoising etc. Finall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T17/00
CPCG06T17/00
Inventor 杨涛徐艳姬王亚坤葛云峰林宇
Owner TSINGHUA UNIV
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