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An anti-impact silicon based MEMS microphone, a system and a package with the same

A microphone and impact-resistant technology, which is applied in the field of microphones, can solve the problem that the sound pressure impact of the microphone is easily damaged, and achieve the effect of reducing stress

Active Publication Date: 2015-04-22
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, as can be seen from the above description, there is a problem whether it is a conventional MEMS microphone alone or a conventional MEMS microphone package with such a microphone, that is, the fragile and fragile diaphragm of the conventional MEMS microphone is damaged due to, for example, a drop test. are susceptible to damage from very high sound pressure shocks

Method used

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  • An anti-impact silicon based MEMS microphone, a system and a package with the same
  • An anti-impact silicon based MEMS microphone, a system and a package with the same
  • An anti-impact silicon based MEMS microphone, a system and a package with the same

Examples

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no. 1 example

[0043] figure 2 is a cross-sectional view showing the structure of the shock-resistant silicon-based MEMS microphone according to the first embodiment of the present invention. image 3 is a plan view showing figure 2 An example pattern of the microphone diaphragm in when viewed from its top side. MEMS microphones can receive acoustic signals and convert the received acoustic signals into electrical signals for subsequent processing and output. Such as figure 2 As shown, the shock-resistant silicon-based MEMS microphone 10 a according to the first embodiment of the present invention includes a silicon substrate 100 with a back hole 140 , a conductive and compliant diaphragm 200 , a perforated back plate 400 , and an air gap 150 . The diaphragm 200 is formed using a part of the silicon device layer such as the top silicon film on a silicon-on-insulator (SOI) wafer or using a polysilicon thin film formed by a deposition process, and the diaphragm 200 is stacked on the sili...

no. 2 example

[0051] Figure 6 is a cross-sectional view showing the structure of the shock-resistant silicon-based MEMS microphone according to the second embodiment of the present invention. Figure 7 is a plan view showing Figure 6 An example pattern of the microphone diaphragm in when viewed from its top side.

[0052] Compared Figure 6 and figure 2 and contrast Figure 7 and image 3 The difference between the shock-resistant silicon-based MEMS microphone 10b described in the second embodiment and the shock-resistant silicon-based MEMS microphone in the first embodiment is that, in the second embodiment, the uniform and / Or symmetrically form a plurality of first through holes 450, and uniformly and / or symmetrically form a limiter mechanism including a plurality of limiters 700 near the edge of the diaphragm 200, and the plurality of limiters 700 are connected to a plurality of Corresponding to the first through hole 450, each T-shaped limiter 700 has a lower portion 710 an...

no. 3 example

[0054] Figure 8 is a cross-sectional view showing the structure of the shock-resistant silicon-based MEMS microphone according to the third embodiment of the present invention.

[0055] Compared Figure 8 and Figure 6 The difference between the shock-resistant silicon-based MEMS microphone 10c in the third embodiment and the shock-resistant silicon-based MEMS microphone in the second embodiment is that in the third embodiment, the shock-resistant silicon-based MEMS microphone 10c includes interconnection columns 600, the interconnection column 600 is set between the center of the diaphragm 200 and the center of the back plate 400, and is used to suspend the diaphragm 200 mechanically and lead the diaphragm 200 outward electrically, the diaphragm 200 The perimeter is free to vibrate. An example of the above-mentioned structure of the microphone 10c and its manufacturing method is described in detail in International Application No. PCT / CN2010 / 075514, the relevant content o...

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Abstract

The present invention relates to an anti-impact silicon based MEMS microphone, a system and a package with the same, the microphone comprises: a silicon substrate provided with a back hole therein; a compliant diaphragm supported on the silicon substrate and disposed above the back hole thereof; a perforated backplate disposed above the diaphragm with an air gap sandwiched in between, and further provided with one or more first thorough holes therein; and a stopper mechanism, including one or more T-shaped stoppers corresponding to the one or more first thorough holes, each of which has a lower part passing through its corresponding first thorough hole and connecting to the diaphragm and an upper part being apart from the perforated backplate and free to vertically move, wherein the diaphragm and the perforated backplate are used to form electrode plates of a variable condenser. In the anti-impact microphone, the stopper mechanism may help to restrain the fragile and brittle diaphragm from large movement induced by sound pressure impact in a drop test and thus prevent the diaphragm from being damaged.

Description

technical field [0001] The present invention relates to the technical field of microphones, and more specifically, to an impact-resistant silicon-based MEMS microphone, a system containing the microphone, and a package. Background technique [0002] Silicon-based MEMS microphones, also known as acoustic transducers, have been in development for many years. Silicon-based MEMS microphones can be widely used in many applications, such as mobile phones, tablets, cameras, hearing aids, smart toys, due to their potential advantages in miniaturization, performance, reliability, environmental durability, cost, and mass production capability and monitoring devices. [0003] In general, silicon-based MEMS microphones include a fixed perforated backplate and a highly compliant diaphragm with an air gap formed between the backplate and the diaphragm. The perforated backplate and the compliant diaphragm constituting the variable air gap capacitor are usually formed on a single silicon ...

Claims

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Application Information

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IPC IPC(8): H04R17/02
CPCH04R17/02H04R19/005H04R19/04H04R2201/003H04R7/16H04R2307/023
Inventor 王喆
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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