Heat-resistance phenolic resin adhesive for chemical resistant laminate

A technology of phenolic resin glue and phenolic resin, applied in the direction of adhesives, adhesive additives, carboxyl rubber adhesives, etc., can solve the problem of insufficient thermal stability of phenolic resin, insufficient service life, low impact strength of physical and chemical boards, etc. problems, achieve good fluidity and storage stability, long service life, and obvious toughening effect

Inactive Publication Date: 2015-04-29
ANHUI XIMA OUMEIJIA DECORATIVE MATERIAL IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Phenolic resin is the earliest industrialized synthetic resin in the world. It has a history of nearly a hundred years. The cured product has good corrosion resistance and low cost. At present, phenolic resin occupies an important position in the adhesive of physical and chemical boards. The thermal stability of phenolic resin is not high enough, the toughness is poor, and the service life is short, which leads to the low impact strength of the prepared physical and chemical board, poor thermal stability, and the service life cannot meet the requirements. However, with the advancement of technology, the phenolic resin adhesive The performance can no longer meet the requirements of physical and chemical boards in the high-tech field

Method used

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  • Heat-resistance phenolic resin adhesive for chemical resistant laminate
  • Heat-resistance phenolic resin adhesive for chemical resistant laminate
  • Heat-resistance phenolic resin adhesive for chemical resistant laminate

Examples

Experimental program
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Effect test

Embodiment 1

[0020] A heat-resistant phenolic resin adhesive for physical and chemical boards proposed by the present invention, its raw materials include by weight:

[0021]

[0022] In the preparation process of modified nano-magnesia, add 20 parts by weight of nano-magnesia to 80 parts of absolute ethanol for an ultrasonic dispersion for 2 hours. After heating up to 70°C, carry out ultrasonic dispersion for 5 minutes twice, cool down to 55°C, add 1 part of dicumyl peroxide, carry out ultrasonic dispersion for 40 minutes three times, then reflux at 80°C for 40 minutes, filter, and centrifuge to obtain modified nano-magnesium oxide;

[0023] In the nano-carboxyl-terminated nitrile rubber, the particle size is 10-20nm, which accounts for 5wt%, the particle size is 20-50nm, which accounts for 80wt%, and the remaining particle size is 50-70nm; in the modified nano-magnesia, the particle size is 1-4nm. 10wt%, the particle size is 5-8nm, accounting for 80wt%, and the remaining particle size...

Embodiment 2

[0025] A heat-resistant phenolic resin adhesive for physical and chemical boards proposed by the present invention, its raw materials include by weight:

[0026]

[0027] In the preparation process of modified nano-magnesia, add 30 parts of nano-magnesia to 70 parts of absolute ethanol by weight to carry out ultrasonic dispersion for 1 hour. After heating up to 60°C, carry out ultrasonic dispersion for 15 minutes twice, cool down to 45°C, add 2 parts of dicumyl peroxide, carry out ultrasonic dispersion for 3 times for 20 minutes, then reflux at 90°C for 30 minutes, filter, and centrifuge to obtain modified nano-magnesium oxide;

[0028] Among them, in the nano-carboxylated nitrile rubber, the particle size is 10-20nm, accounting for 15wt%, the particle size is 20-50nm, accounting for 70wt%, and the remaining particle size is 50-70nm; in the modified nano-magnesia, the particle size is 1-4nm Accounting for 15wt%, the particle size of 5-8nm accounts for 50wt%, and the rest of...

Embodiment 3

[0030] A heat-resistant phenolic resin adhesive for physical and chemical boards proposed by the present invention, its raw materials include by weight:

[0031]

[0032] In the preparation process of modified nano-magnesia, 25 parts of nano-magnesia was added to 75 parts of absolute ethanol by weight to carry out ultrasonic dispersion for 1.5 hours. After heating up to 64°C, perform ultrasonic dispersion twice for 10 minutes, cool down to 52°C and add 1.6 parts of dicumyl peroxide for three times ultrasonic dispersion for 32 minutes, then reflux at 86°C for 35 minutes, filter, and centrifuge to obtain modified nano-magnesia ;

[0033] Among them, in the nano-carboxyl-terminated nitrile rubber, the particle size is 10-20nm, accounting for 10wt%, the particle size is 20-50nm, accounting for 75wt%, and the remaining particle size is 50-70nm; in the modified nano-magnesia, the particle size is 1-4nm Accounting for 13wt%, the particle size of 5-8nm accounts for 70wt%, and the ...

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Abstract

The invention discloses a heat-resistance phenolic resin adhesive for a chemical resistant laminate. The adhesive is prepared from the following raw materials in parts by weight: 100 parts of phenolic resin, 4-15 parts of nano-carboxyl-terminated nitrile rubber, 15-18 parts of neoprene CR121, 12-16 parts of modified nano-magnesium oxide, 10-13 parts of nano-silicon dioxide, 5-10 parts of kaolin, 3-8 parts of montmorillonite, 10-12 parts of polyvinylpyrrolidone K3010, 2-6 parts of dipentaerythritol, 1-4 parts of 3-amino propyl trimethoxy silane and 5-10 parts of alkyl phenol polyoxyethylene ether. The heat-resistance phenolic resin adhesive has the advantages of thermal stability, good toughness, excellent mechanical performance and long service life.

Description

technical field [0001] The invention relates to the technical field of adhesives for physical and chemical boards, in particular to a heat-resistant phenolic resin adhesive for physical and chemical boards. Background technique [0002] Phenolic resin is the earliest industrialized synthetic resin in the world. It has a history of nearly a hundred years. The cured product has good corrosion resistance and low cost. At present, phenolic resin occupies an important position in the adhesive of physical and chemical boards. The thermal stability of phenolic resin is not high enough, the toughness is poor, and the service life is short, which leads to the low impact strength of the prepared physical and chemical board, poor thermal stability, and the service life cannot meet the requirements. However, with the advancement of technology, the phenolic resin adhesive The performance can no longer meet the requirements of physical and chemical boards in the high-tech field. How to p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/06C09J113/00C09J111/00C09J139/06C09J171/00C09J11/04C09J11/06
Inventor 徐学武
Owner ANHUI XIMA OUMEIJIA DECORATIVE MATERIAL IND
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