Manufacturing method of high coupling degree and high frequency circuit board

A high-frequency circuit board and manufacturing method technology, which is applied in the direction of printed circuit manufacturing, printed circuit, and chemical/electrolytic method to remove conductive materials, etc., can solve the problem of not having high frequency, thinning and stable frequency characteristics , to achieve the effect of improving production efficiency and product quality, and solving debugging difficulties

Inactive Publication Date: 2015-04-29
TAIZHOU JINDING ELECTRONICS
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its physical properties, precision, and technical parameters are very high, and it is often used in automotive anti-collision systems, satellite systems, radio systems and other fields; although ordinary high-frequency circuit boards have excellent high heat resistance, high heat dissipation, and excellent size In addition to stability, but does not have high frequency, thinner and stable frequency characteristics

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of high coupling degree and high frequency circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Such as figure 1 As shown, a method for making a high-coupling high-frequency circuit board includes the following steps: Step 1 uses a high-precision laser photoplotter with a resolution of 20240dpi to make a black negative film; uses a 200-fold magnifying glass to check the negative film, and uses a 5KW The exposure machine copies the diazo film. Step 2 Before drilling, treat the pre-cut board with a 500-mesh nylon brush before wrapping the board. Drilling is 2-4 pieces of drilling. The diameter of the pin hole drilled on the short side of the composite board is 3.2mm. The CNC drilling machine uses a 45-degree drill, and the number of holes drilled by the drill is less than 1,000 holes. After drilling, use sandpaper of more than 2,000 mesh to treat the burrs and burrs on the surface of the composite board. Step 3 Use an 800-mesh roller brushing machine to grind the surface of the composite board; before the composite board is aligned, first pre-align the production f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a manufacturing method of a high coupling degree and high frequency circuit board. The manufacturing method comprises the following steps: step one, manufacturing project files and Plotted films; step two, cutting, pretreating a copper-clad plate, and drilling; step three, manufacturing surface patterns; step four, electroplating and etching; step five, forming. The manufacturing method has the advantages that modes of pre-grinding of the plate before drilling and pre-alignment of film production are adopted in the manufacturing process, so that the problem that antenna type high frequency plates are difficult to debug caused by the deformation of the films or the copper-clad plate is solved, and the production efficiency and product quality are greatly improved.

Description

technical field [0001] The invention relates to the manufacture of a circuit board, in particular to a method for manufacturing a high-coupling high-frequency circuit board. Background technique [0002] High-frequency circuit boards are special circuit boards with high electromagnetic frequencies. Generally speaking, high-frequency circuit boards can be defined as frequencies above 1GHz. Its physical properties, precision, and technical parameters are very high, and it is often used in automotive anti-collision systems, satellite systems, radio systems and other fields; although ordinary high-frequency circuit boards have excellent high heat resistance, high heat dissipation, and excellent size In addition to stability, it does not have high frequency, thinner and stable frequency characteristics. Contents of the invention [0003] In order to overcome the above problems, the present invention adopts the following technical solutions: [0004] A method for manufacturing...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/06H05K2203/0789
Inventor 蔡新民
Owner TAIZHOU JINDING ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap