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A kind of processing method of micro-pipe

A processing method and pipeline technology, applied in the process for producing decorative surface effects, microstructure technology, microstructure devices, etc., can solve problems such as unfavorable testing, device function failure, film collapse and fragmentation

Active Publication Date: 2019-11-12
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Although the wet etching rate is fast, the cost is low, the etching thickness can reach the thickness of the entire silicon wafer, and it has high mechanical strength, but the micron pipes manufactured by this method need to overcome the adhesion effect during the release process, that is, the device When leaving the solution, the film collapses and cracks due to the surface tension of the solution, resulting in complete failure of the device function
This is neither good for testing nor good for application

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  • A kind of processing method of micro-pipe
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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that, in each implementation manner of the present invention, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in each claim of the present application can be realized.

[0024] The first embodiment of the present invention relates to a processing method for micron pipes, the specific process is as follows figure 1 shown.

[0025] In step 101, a substrate is provided, wherein the substrate has holes in a periodic lattice structure. The top view of the substrate is as Figure 2A As shown, 2...

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Abstract

The invention relates to surface micromachining technologies, and discloses a processing method for a micrometer pipe. The method comprises the following steps: providing a substrate, wherein the substrate possesses holes with a periodic lattice structure; depositing a sacrificial layer film on the substrate; depositing a structural layer film on the sacrificial layer film; and removing the sacrificial layer film, so as to obtain the micrometer pipe curled by the structural layer film, wherein the outer wall of the micrometer pipe possesses a periodic embossed array copied from the substrate. Therefore, the outer wall of the manufactured micrometer pipe possesses the periodic embossed array, and the micrometer pipe possesses relatively good optical properties.

Description

technical field [0001] The invention relates to surface micromachining technology, in particular to a micron pipe processing method. Background technique [0002] Micro-Electro-Mechanical-System (MEMS) based on silicon materials is considered to be a revolutionary new technology in the 21st century, which will have a profound impact on science and technology, production methods and human life. . [0003] MEMS processing technology can be divided into surface micromachining technology, bulk micromachining technology, bonding technology, photolithography electroforming technology and sacrificial layer photolithography electroforming technology. [0004] Surface micromachining technology is to deposit sacrificial layer materials on the substrate first, then deposit structural materials, etch away the sacrificial layer to form various microstructures. [0005] Micron pipes are obtained through the above-mentioned surface micromachining technology. However, the surface of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00
Inventor 纪新明黄涛李洁惠
Owner FUDAN UNIV