Print semiconductor integration manufacture device
A technology for manufacturing equipment and semiconductors, used in printing, typewriters, etc., can solve the problems of cumbersome and time-consuming process alignment, and achieve the effects of reducing costs, improving manufacturing accuracy, and facilitating operations
Inactive Publication Date: 2015-05-13
NANJING HUAYIN SEMICON
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Problems solved by technology
[0004] The purpose of the present invention is to propose a device that integrates all the processes of printing and preparing semiconductor electronics and optoelectronic devices to achieve centralized control, simplify operations and pass Common base for quick alignment
Method used
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[0014] Combine below figure 1 The inventive scheme is more fully described.
[0015] The structure of the present invention is as figure 1 As shown, through the ingenious design of the lateral displacement platform (13) and the mobile base and heating platform (14), the printing system (12), the slit extrusion coating system (15), the gravure printing system (16), The flexible scraper coating system (17) and the flexible substrate roll equipment (18) are integrated to work together without moving the device substrate (the flexible substrate roll equipment cuts the flexible substrate and fixes it on the mobile base), thereby realizing different process manufacturing Quick alignment in the middle. By printing system (12), slit extrusion coating system (15), gravure printing system (16), flexible doctor blade coating system (17), the control of flexible substrate roll equipment (18) is integrated together, like this Can simplify operation and save time.
[0016] The equipment...
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Disclosed is a print semiconductor integration manufacture device. The print semiconductor integration manufacture device comprises a device bottom seat (11), wherein a transverse displacement platform (13), a mobile base seat, a heating platform (14), a flexible substrate coil device (18) used to unwind print semiconductor flexible substrate material, cut the print semiconductor substrate material according to size demands, and move and heat the print semiconductor substrate material and a platform used to integrally manufacture a print semiconductor on the flexible substrate material are arranged on the device bottom seat (11), a print system and a UV (ultraviolet) lamp (12) are additionally arranged on the device bottom seat (11), and furthermore a computer control system is arranged on the device bottom seat (11), and used to control movement, positioning and work of the mobile base seat and the heating platform (14) on the transverse displacement platform (13) and work of the print system and the UV lamp (12). The mobile base seat is ingeniously designed, and integrates all the above components to work, and therefore rapid alignment in a production process can be achieved without need of moving the device bottom seat. Simultaneously, all the above components are integrated in the print semiconductor integration manufacture device, and therefore cost is reduced, and simplification of operation is achieved.
Description
technical field [0001] The invention is an integrated equipment for preparing semiconductor electronic and optoelectronic devices and circuits by integrating multiple printing processes, that is, many technological processes of electronic devices and circuits are completed in one device, and belongs to the field of semiconductor manufacturing equipment. Background technique [0002] Printed semiconductor technology prepares various semiconductor devices and circuits through the printing process. It does not require high temperature and vacuum equipment. The process steps are simple, which can significantly reduce facility investment and production maintenance costs, and shorten the production cycle; it is also conducive to realizing light weight based on flexible substrate materials. , Flexible and bendable electronic device product applications; and have achieved practical applications in sensing units, electronic paper display backplanes, radio frequency identification labe...
Claims
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IPC IPC(8): B41J3/44B41J3/54
Inventor 武倩边惠郭小军
Owner NANJING HUAYIN SEMICON