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Nicu alloy target and laminated film for cu electrode protective film

A technology of electrode protective film and alloy target, which is applied in the field of NiCu alloy target and laminated film for Cu electrode protective film, which can solve the problems of low magnetic permeability of the target material and no one has raised the problem of Cu electrode protective film, so as to achieve effective sputtering , The effect of suppressing the deterioration of electrical characteristics and improving the adhesion

Active Publication Date: 2017-04-12
DAIDO STEEL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in order to effectively perform sputtering, the magnetic permeability of the target is required to be low
However, until now, no one has proposed an example of a Cu electrode protective film target that satisfies all of these conditions at the same time, and a laminated film produced using such a target.

Method used

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  • Nicu alloy target and laminated film for cu electrode protective film
  • Nicu alloy target and laminated film for cu electrode protective film
  • Nicu alloy target and laminated film for cu electrode protective film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0144] [1. Preparation of sample]

[0145] A Ni-Cu-Cr alloy target with a predetermined composition is prepared by a dissolution casting method. The Cu content is set to 10 to 60% by mass. The Cr content is set to 0 to 11% by mass. In addition, a Ni-35mass%Cu-1.5mass%Cr-1.5mass%Ti alloy target was prepared by a dissolution casting method. Further, pure Cu and ITO were used for comparison.

[0146] [2. Test method]

[0147] [2.1. Potential difference]

[0148] The standard potentials of Ni-Cu-Cr alloy, Ni-Cu-Cr-Ti alloy, Cu and ITO were measured respectively. Using a carbon electrode as a counter electrode and a calomel electrode as a reference electrode, the standard potential was measured using a potentiostat method in a 200 g / L ammonium sulfate aqueous solution maintained at 40°C.

[0149] Using the obtained standard potential of each material, calculate the potential difference ΔV (V) between Ni-Cu-Cr alloy or Ni-Cu-Cr-Ti alloy and Cu, and the potential difference bet...

Embodiment 2

[0203] [1. Preparation of sample]

[0204] A Ni-Cu-Ti alloy target with a predetermined composition is prepared by a dissolution casting method. The Cu content is set to 10 to 60% by mass. The Ti content is set to 0 to 7% by mass. In addition, as a comparison, pure Cu and ITO were used.

[0205] [2. Test method]

[0206] According to the same procedure as Example 1, the potential difference ΔV between Ni-Cu-Ti alloy and Cu, the potential difference ΔV between Ni-Cu-Ti alloy and ITO, the potential difference ΔV between Ni-Cu-Ti alloy and Cu, The etch rate difference, the stripping rate, and the maximum magnetic permeability μ.

[0207] [3. Results]

[0208] [3.1. Potential difference △V]

[0209] Figure 9 The potential difference ΔV between Ni-Cu-Ti alloy and ITO is shown in . Figure 9 , the dotted line indicates the potential difference ΔV (0.16 V) between Mo-10Nb and ITO used as a protective film for Al-based wiring material in the prior art.

[0210] Figure 10 T...

Embodiment 3

[0249] [1. Preparation of sample]

[0250] Using the target prepared in Example 1 or 2, a laminated film for a touch panel was prepared. That is, a barrier layer, an electrode layer, and a cover layer are sequentially formed (from bottom to top) on the surface of the substrate by sputtering. As the substrate, an ITO / underlayer film / PET substrate or an ITO / underlayer film / glass substrate (both commercially available) was used. A NiCu alloy containing a predetermined amount of Cu or Ti was used for the barrier layer and the cover layer, respectively, and Cu(5N) was used for the electrode layer.

[0251] For comparison, a laminated film was prepared in which Mo-10Nb alloy was used in the barrier layer and the cover layer, respectively, and Al-3Nd was used in the electrode layer.

[0252] Table 1 shows the film-forming conditions of the laminated film for touch panels.

[0253] Table 1

[0254] material power gas sputtering rate film thickness NiCu alloy...

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Abstract

PROBLEM TO BE SOLVED: To provide a Ni-Cu alloy target material for a Cu electrode protective film, which can form a protective film that can be used as a protective film for a Cu electrode, can suppress deterioration in the electrical characteristics caused by electrolytic corrosion and atomic diffusion of the Cu electrode, can achieve patterning at high precision by wet etching, and has satisfactory adhesion with a transparent electrode, and further which can efficiently perform sputtering, and to provide a laminated film produced using the Ni-Cu alloy target material for a Cu electrode protective film.SOLUTION: The Ni-Cu alloy target material for a Cu electrode protective film includes: Cu of 15.0 to 55.0 mass%; (Cr, Ti) of 0.5 to 10.0 mass%; and the balance Ni with inevitable impurities. The laminated film is produced by using the Ni-Cu alloy target material for a Cu electrode protective film.

Description

[0001] This application is a divisional application of an application with a filing date of August 30, 2011, an application number of 201110261494.5, and an invention title of "NiCu alloy target and laminated film for Cu electrode protection film". technical field [0002] The present invention relates to a NiCu alloy target for a Cu electrode protective film and a laminated film. Specifically, the present invention relates to a NiCu alloy target for a Cu electrode protective film for forming a Cu electrode protective film used as an electrode of a touch panel or a liquid crystal panel. material, and a laminated film manufactured using the target material. Background technique [0003] Liquid crystal panels used in touch panels and thin large-screen televisions have a structure in which liquid crystal is sealed between two transparent substrates. A transparent electrode serving as a working electrode of the liquid crystal is formed inside the transparent substrate (one surfa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C19/05C22C19/03C22C9/06
Inventor 大森浩志坂口一哉胜见昌高
Owner DAIDO STEEL CO LTD
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