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High power semiconductor lighting source

A lighting source and semiconductor technology, applied in the field of high-power semiconductor lighting sources, can solve the problems of LED light source cost increase, poor thermal conductivity, and heat dissipation obstacles, and achieve excellent lighting effects, good replaceability, and stability.

Active Publication Date: 2018-02-16
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, the thermal conductivity of the optical system composed of these materials is poor. As the thickness and volume of the material increase, the hindrance to heat dissipation becomes more obvious, which in turn further increases the burden on the heat sink on the back of the LED light source.
On the other hand, as the thickness of the material of the optical system increases, the absorption of the light emitted by the LED device by the optical system also increases, resulting in a decrease in the utilization rate of light energy.
Moreover, as the thickness and volume of the material of the optical system increase, the thickness and volume of the heat sink on the back of the LED light source must also increase accordingly to achieve good heat dissipation. This design greatly increases the volume and weight of the LED light source , which in turn leads to an increase in the cost of the LED light source and brings a lot of inconvenience to the application
[0007] In summary, there is still a lack of high-power (greater than 10W) ​​semiconductor lighting sources that are light in weight, low in cost, and have excellent lighting effects and heat dissipation effects.

Method used

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Embodiment approach

[0055] see figure 1 , The high-power semiconductor lighting source 10 provided by the embodiment of the present invention includes: an LED module 11 , a light distribution unit 12 , a radiator 14 and a power connector 15 thereof. The power connector 15 is electrically connected to the LED module 11, and the LED module 11 receives external electric energy through the power connector 15 and converts the electric energy into light energy. The heat sink 14 is in direct contact with the LED module 11 and dissipates the heat generated by the LED module 11 to the outside. The light distribution unit 12 is arranged on the side of the LED module 11 opposite to the heat sink 14 , and is used to distribute the light emitted by the LED module 11 to the outside evenly.

[0056] The heat sink 14 includes a base plate 141 and fins 142. The base plate 141 includes two opposite surfaces. The fins 142 extend outward from one surface of the base plate 141. free end. The LED module 11 is dispo...

Embodiment 1

[0065] figure 2 It is a schematic structural diagram of the high-power semiconductor lighting source provided by Embodiment 1 of the present invention. The high-power semiconductor lighting source 10 of this embodiment includes an LED module 11 , a light distribution unit 12 , a radiator 14 and a power connector 15 thereof. The LED module 11 is a square AC LED Lambertian chip with a side length of 20mm. The LED module 11 is directly connected to the mains through the power connector 15 . The LED module 11 is arranged in direct contact with the substrate 141 of the heat sink 14 . The power of the LED module 11 is 100W, the electro-optical conversion efficiency is 50%, and the thermal power is 50W. The light distribution unit 12 includes a package housing 121 and a filling liquid 122 . The package casing 121 is a hollow casing, which includes an outer surface 125 and an inner surface 126 . In this embodiment, the outer surface 125 of the packaging case 121 is a free curved ...

Embodiment 2

[0069] Image 6 A schematic structural diagram of a high-power semiconductor lighting source 10 provided by Embodiment 2 of the present invention. The high-power semiconductor lighting source 10 of this embodiment includes an LED module 11 , a light distribution unit 12 , a radiator 14 and a power connector 15 thereof. The structure of the high-power semiconductor lighting source provided in Embodiment 2 is basically the same as that of the high-power semiconductor lighting source provided in Embodiment 1. The difference is as follows: the LED module 11 is a square LED Lambertian chip with a side length of 20mm, and is electrically connected to one end of the light source driver 17 arranged in the package housing 121 through the power connector 15, and the power connector 15 is connected from the The other end of the light source driver 17 is connected to the commercial power. The light distribution unit 12 formed by the encapsulation case 121 and the filling liquid 122 of t...

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Abstract

The invention provides a high-power semiconductor illuminating light source. The high-power semiconductor illuminating light source comprises an LED (light emitting diode) module, a light distributing unit and a heat sink, wherein the LED module can be used for converting electric energy into luminous energy and is arranged between the light distributing unit and the heat sink; the heat sink comprises a substrate and fins; the fins extend outwards from a surface of the substrate to the direction which is far away from the surface of the substrate; the LED module is arranged on the other surface, which is opposite to the surface with the fins, of the substrate; the light distributing unit comprises a packaging shell and filling liquid; the packaging shell is a hollow shell; space formed by the packaging shell and the substrate is filled with the filling liquid; and the LED module is positioned in the space and soaks in the filling liquid. The high-power semiconductor illuminating light source is light in weight and low in cost, and has an excellent illuminating effect and an excellent heat dissipation effect.

Description

technical field [0001] The invention relates to a high-power semiconductor lighting source. Background technique [0002] Due to the advantages of energy saving and environmental protection, semiconductor lighting has been included in my country's strategic emerging industries, and has been widely used in general lighting fields such as indoor lighting, outdoor lighting and landscape lighting. Semiconductor lighting technology is developing rapidly, and the light efficiency of high-end commercial semiconductor lighting sources has reached 150lm / W. However, even for such a high-efficiency semiconductor lighting source, only 30%-60% of the input electric power is converted into light energy, and 70%-40% of the electric energy is still converted into heat. If the heat cannot be dissipated in time, it will lead to an increase in the junction temperature of the LED chip, which in turn will lead to a decrease in its luminous efficiency, a shortened lifespan, and a shift in the lu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/235F21V19/00F21V29/76F21Y115/10
CPCF21S2/005F21V5/00F21V19/001F21Y2101/00
Inventor 罗毅韩彦军李洪涛毛祥龙
Owner TSINGHUA UNIV