Multilayer ceramic electronic assemblies and printed circuit boards embedded in boards
A technology of multilayer ceramics and electronic components, which is applied in the manufacture of printed circuits, printed circuits, and multilayer circuits, etc., and can solve problems such as increasing costs and deteriorating reliability
Active Publication Date: 2018-02-02
SAMSUNG ELECTRO MECHANICS CO LTD
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Problems solved by technology
[0011] However, forming a copper (Cu) plating layer raises the cost and also causes a problem of deterioration of reliability due to penetration of the plating solution, so a solution thereto is still required
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[0059] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
[0060] However, this disclosure may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
[0061] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.
[0062] figure 1 is a perspective view illustrating a multilayer ceramic electronic component to be embedded in a board according to an exemplary embodiment of the present disclosure.
[0063] figure 2 yes figure 1 A side view of a multilayer ceramic electronic assembly to be embedded in a board.
[0064] image 3 is...
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Abstract
A multilayer ceramic electronic component to be embedded in a board and a printed circuit board with a multilayer ceramic electronic component embedded therein are provided, the multilayer ceramic electronic component comprising: a ceramic body including a dielectric layer and having a mutual Opposite first and second main surfaces, first and second side surfaces opposite to each other, and first and second end surfaces opposite to each other; first internal electrodes and second internal electrodes, stacked into respectively spaced a predetermined distance from both end surfaces of the ceramic main body and interposes a dielectric layer between the first internal electrode and the second internal electrode; the first external electrode and the second external electrode are formed on both ends of the ceramic main body Among the end portions, the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, and the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode. Terminal electrodes, non-conductive paste layers are formed on both side surfaces of the ceramic body.
Description
[0001] This application claims the benefit of Korean Patent Application No. 10-2013-0132847 filed in the Korean Intellectual Property Office on November 4, 2013, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a multilayer ceramic electronic component embedded in a board and a printed circuit board having a multilayer ceramic electronic component embedded therein. Background technique [0003] As electronic circuits have become highly dense and highly integrated, the mounting space for passive components mounted on a printed circuit board (PCB) has become insufficient. In order to solve this problem, efforts have been continuously made to realize components that can be mounted in boards, such as embedded devices. In particular, various methods have been proposed for mounting multilayer ceramic electronic components serving as capacitive components in boards. [0004] As one of various methods of mountin...
Claims
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IPC IPC(8): H01G4/232H01G4/30H05K1/18
CPCH01G4/224H01G4/232H01G4/2325H01G4/30H05K1/185H05K2201/10015H05K3/46
Inventor 李海峻郑镇万
Owner SAMSUNG ELECTRO MECHANICS CO LTD