Multi-level converter submodule as well as inverter circuit and MMC topology both manufactured from such submodule
A multi-level converter and sub-module technology, which is applied in the directions of irreversible DC power input conversion to AC power output, high-efficiency power electronic conversion, and AC power input conversion to DC power output, etc. The problem of large switching loss and high voltage can achieve the effect of reducing the output harmonic component, reducing the switching loss and increasing the switching frequency
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[0024] Example 1:
[0025] See image 3 The multi-level converter sub-module shown uses IGBT and S i C-MOSFET hybrid full bridge sub-module structure design, including left branch Z, right branch Y, capacitor C, left branch Z, right branch Y, and capacitor C in parallel, and left branch Z includes 2 IGBTs Components, the first IGBT component 1 and the second IGBT component 2, the right branch Y includes 2 S i C-MOSFET element, first S i C-MOSFET element 3 and second S i The C-MOSFET element 4, the first IGBT element 1, the second IGBT element 2, the first SiC-MOSFET element 3, and the second SiC-MOSFET element 4 are bridged in sequence, that is: the emitter of the first IGBT element 1 is connected to the second IGBT The collector of the element 2, the emitter of the second IGBT element 2 is connected to the source of the second SiC-MOSFET element 4, and the drain of the second SiC-MOSFET element 4 is connected to the source of the first SiC-MOSFET element 3. The drain of the SiC-...
Example Embodiment
[0028] Example 2:
[0029] See Figure 4 Shown: an inverter circuit made of multi-level converter sub-modules, using IGBT and S i C-MOSFET hybrid full-bridge sub-module structure design, including left branch Z, right branch Y, capacitor C, resistance R and reactor G, left branch Z, right branch Y, and capacitor C are connected in parallel. Branch Z includes 2 IGBT elements, the first IGBT element 1 and the second IGBT element 2, and the right branch Y includes 2 S i C-MOSFET element, first S i C-MOSFET element 3 and second S i The C-MOSFET element 4, the first IGBT element 1, the second IGBT element 2, the first SiC-MOSFET element 3, and the second SiC-MOSFET element 4 are bridged in sequence, that is: the emitter of the first IGBT element 1 is connected to the second IGBT The collector of the element 2, the emitter of the second IGBT element 2 is connected to the source of the second SiC-MOSFET element 4, and the drain of the second SiC-MOSFET element 4 is connected to the sourc...
Example Embodiment
[0031] Example 3:
[0032] Such as Figure 5 As shown, the MMC topology made by multi-level converter sub-modules is composed of six bridge arms 5. Each bridge arm 5 is composed of several interconnected multi-level converter sub-modules SM and a reactor L is formed in series, the upper and lower bridge arms form a phase unit, the six bridge arms have symmetry, and the electrical parameters of each sub-module and the reactance value of each bridge arm are the same. The structure of the sub-module SM of the multilevel converter is as follows image 3 As shown, the structure adopts a three-phase six-branch structure, each bridge arm 5 is formed by cascading a certain number of sub-modules, and a reactor L is configured to suppress the circulating current and the rising rate of fault current. By IGBT and S i The multi-level converter sub-module composed of C-MOSFET can be regarded as a small power converter. The increase of the switching frequency of each unit will inevitably enabl...
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