A kind of manufacturing method of comprehensive silver circuit board
A technology of a silver circuit board and a manufacturing method, which is applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, and the improvement of metal adhesion of insulating substrates, can solve the problems of signal delay, PCB signal transmission loss, etc., to reduce signal delay. time, the effect of reducing the loss of signal transmission
Active Publication Date: 2017-12-29
JIANGMEN SUNTAK CIRCUIT TECH
View PDF2 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Among them, browning is the copper surface treatment of the production board after the inner layer etching and inner layer AOI, and an oxide layer is formed on the surface of the inner layer copper foil to improve the copper foil and epoxy resin when the multilayer circuit board is pressed. The bonding force between them (common black oxidation and brown oxidation, etc.), and the oxide layer generated by the browning process will cause PCB signal transmission loss and signal delay
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreExamples
Experimental program
Comparison scheme
Effect test
Embodiment
[0032] Make circuit board
[0033] Inner core board: 1.1mm H / H Number of layers: 4L
[0034] Inner line width spacing: Min 3 / 3miL Outer line width spacing: Min 4 / 4miL
[0035] Outer copper foil: HOZ hole copper thickness: Min 25μm
[0036] Solder mask: TOP surface green oil (thickness according to IPC standard) Surface technology: silver
[0037] production process
[0038] Cutting - cut out the core board according to the panel size 520mm*620mm, the thickness of the core board is 0.5mm H / H;
[0039] Inner layer graphics transfer - use a vertical coating machine to coat the photosensitive film, the film thickness of the photosensitive film is controlled to 8μm, and use a fully automatic exposure machine to complete the inner layer circuit exposure with 5-6 grid exposure rulers (21 grid exposure rulers);
[0040] Inner layer etching - etching the exposed core board, after the inner layer is etched, the line width of the inner layer is 3 / 3miL, the copper thickness of the tin...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses a method for manufacturing a comprehensive silver circuit board, which belongs to the field of PCB manufacturing. The manufacturing method includes the following processes in sequence: inner layer circuit making, inner layer sandblasting pre-treatment, inner layer full plate silverization, inner layer sandblasting post-treatment, pressing, drilling, outer layer circuit making, outer layer spraying Sand treatment, silver plating on the outer layer, anti-soldering. In the manufacturing method of the comprehensive silver circuit board of the present invention, both the inner layer and the outer layer use silver to treat the copper surface, which can reduce the loss of signal transmission and the time of signal delay.
Description
technical field [0001] The invention belongs to the field of PCB production and manufacturing, and in particular relates to a method for manufacturing a comprehensive silver circuit board. Background technique [0002] The existing PCB production process is: material cutting, inner layer graphics, inner layer etching, inner layer AOI, browning, pressing, drilling, and post-processing. Among them, browning is the copper surface treatment of the production board after the inner layer etching and inner layer AOI, and an oxide layer is formed on the surface of the inner layer copper foil to improve the copper foil and epoxy resin when the multilayer circuit board is pressed. The bonding force between them (common black oxidation and brown oxidation, etc.), and the oxide layer generated by the browning process will cause PCB signal transmission loss and signal delay. Contents of the invention [0003] In order to solve the above problems, the present invention provides a metho...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/22H05K3/38
CPCH05K3/282H05K3/4644H05K2203/0323
Inventor 白会斌黄力张义兵王海燕
Owner JIANGMEN SUNTAK CIRCUIT TECH