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Manufacturing technology of CEM-3 type copper-clad plate

A manufacturing process and technology for copper clad laminates, which are applied in the field of CEM-3 type copper clad laminate manufacturing processes to achieve the effects of improving binder system, improving performance and reducing warpage

Inactive Publication Date: 2015-05-20
QINGDAO HONGTAI COPPER IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because of its obvious performance and cost advantages, the usage is gradually increasing, but because the board core is a composite material of glass fiber paper and organic filler, there are many difficulties to be solved in the production process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0016] a. Preparation of resin: Add solid epoxy resin, inorganic filler, coupling agent, and organic solvent into the reaction vessel, heat, dissolve and reflux under stirring state. After completely dissolving, add the pre-dissolved dicyandiamide solution, and finally add Liquid epoxy and curing accelerator, control the gelation time at 300-450s;

[0017] b. Production of prepregs: In a vertical dipping machine, glass fiber paper is impregnated with resin solution to make core prepregs, and glass cloth is impregnated with resin solution to make surface prepregs;

[0018] c. Manufacture of copper clad laminates: according to the thickness requirements of the pressed copper clad laminates, weigh the prepregs, stack them, cover them with copper foil, install the mold, raise the temperature to 170°C, keep the temperature and pressure for 1.5h, and then cool down and release the mold.

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PUM

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Abstract

The invention discloses a manufacturing technology of a CEM-3 type copper-clad plate. The technology comprises steps of resin preparation, semi-solidified sheet manufacturing, and copper-clad plate manufacturing. An inorganic filling material is added to improve the performance and reduce the cost, moreover, the adhesive system is improved, the linear expansion coefficient of sheet material is reduced, the warping of copper-clad plate is reduced, and the operation is simple and convenient.

Description

[0001] technical field [0002] The invention belongs to the manufacturing process of copper-clad laminates, and in particular relates to a manufacturing process of CEM-3 type copper-clad laminates. [0003] Background technique [0004] Compared with FR-4 copper clad laminates, epoxy glass cloth glass fiber paper core copper clad laminates, namely NEMA standard CEM-3 copper clad laminates, have good punching and shearing performance at room temperature, excellent dimensional stability, good ion migration resistance, and low cost. Because of its obvious performance and cost advantages, the usage is gradually increasing. However, because the board core is a composite material of glass fiber paper and organic filler, there are many difficulties to be solved in the manufacturing process. [0005] Contents of the invention [0006] In order to overcome the above-mentioned defects in the prior art, the object of the present invention is to provide a CEM-3 copper clad laminate...

Claims

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Application Information

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IPC IPC(8): B32B37/04B32B27/06B32B15/20H05K1/02H05K3/02
CPCB32B37/153B32B37/02B32B37/06B32B37/10B32B38/08B32B2307/734B32B2457/08
Inventor 李保成
Owner QINGDAO HONGTAI COPPER IND