Power Transistor Array Structure Integrated with Electrostatic Protection Circuit

A technology for power transistors and electrostatic protection, applied in circuits, thyristors, electro-solid devices, etc., can solve problems such as easy triggering and reduction of the safe working range of power transistor arrays, reduce false triggering, improve electrostatic protection capabilities, expand The effect of safe working area

Active Publication Date: 2017-08-08
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although embedding SCR can effectively improve the electrostatic protection capability of the output power transistor array, it will be a technical difficulty in this design to avoid false triggering of the SCR when the power transistor array is working normally. The higher the voltage and the higher the current, the easier it is for the SCR to trigger , so the embedded SCR will reduce the safe operating range (SOA) of the power transistor array

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Power Transistor Array Structure Integrated with Electrostatic Protection Circuit
  • Power Transistor Array Structure Integrated with Electrostatic Protection Circuit
  • Power Transistor Array Structure Integrated with Electrostatic Protection Circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] Such as Figure 2A As shown, it is a schematic diagram of a layout structure of a power transistor array according to an embodiment of the present invention; Figure 2B shown, is along the Figure 2A Schematic diagram of the cross-sectional structure of the unit structure at the B'B position of ; a deep N well (DNW) 2 is formed on the silicon substrate 1, and the entire power transistor array is formed in the deep N well 2, and the unit of the power transistor Structure one is the NLDMOS device structure, including:

[0039] A P-type body region 3 formed in the deep N well 2 .

[0040] An N well 4 is formed in the deep N well 2 and is separated from the P-type body region 3 by a certain distance.

[0041] The drain region 8b is composed of the N+ region formed in the N well 4; a field oxygen layer 5 is formed between the drain region 8b and the P-type body region 3, and the drain region 8b and the field The oxygen layer 5 is self-aligned.

[0042]The source region ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a power transistor array structure integrated with an electrostatic protection circuit. By replacing a part of the drain region of the unit structure 1 of the power transistor with the P+ region, the electrostatic protection circuit formed by SCR can be embedded. The gate is not connected to the gate of the unit structure 1, and the gate of the SCR is connected to the source of the unit structure 1; the present invention can improve the performance of the power transistor array without affecting the performance of the power transistor array and without changing the process. The electrostatic protection ability can effectively reduce the false triggering phenomenon of the thyristor, thereby expanding the safe working range of the power transistor array. At the same time, by setting the gate structure of the SCR to be recessed toward the drain region and injecting the P+ region into the body region on the source region side, the present invention can further reduce false triggering of thyristors and expand the safe operation of power transistor arrays. scope.

Description

technical field [0001] The invention relates to a semiconductor integrated circuit, in particular to a power transistor array structure integrated with an electrostatic protection circuit. Background technique [0002] Power transistors are often used in high-voltage integrated circuits as output drive tubes that drive relatively large currents. Existing power drive tubes generally appear in the form of arrays. Such as Figure 1A Shown is a schematic diagram of the existing power transistor array layout structure; Figure 1B is along Figure 1A Schematic diagram of the cross-sectional structure of the unit structure at position A'A of ; a deep N well (DNW) 2 is formed on the silicon substrate 1, and the entire power transistor array is formed in the deep N well 2, and the unit of the power transistor Structure one is the NLDMOS device structure, including: [0003] A P-type body region 3 formed in the deep N well 2 . [0004] An N well 4 is formed in the deep N well 2 and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/02H01L29/74H01L29/423
Inventor 武洁
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products