Structure and manufacturing process of a kind of led module

Abstract

The invention discloses a manufacturing process and structure of an LED module, which is characterized in that the LED chip is fixed on the upper surface of a substrate through an insulating adhesive layer; two LED chips form a pair of LEDs, and the electrode faces upward; Then the substrate electrode is fixed on the upper surface of the substrate through an insulating adhesive layer; and then the bonding wire is bonded between the substrate electrode and the electrode of the LED chip; a parallel connection part is set between every two adjacent LED pairs , the bonding wire is drawn from the electrodes of each LED chip in the LED pair and connected to the parallel part, so that the LED pair becomes an electrically parallel parallel unit; all the parallel units are connected in series through the parallel part to form an LED string; finally The phosphor layer is applied to cover the LED chip, bonding wire and insulating adhesive layer; the substrate itself of this solution omits all insulating layers and soldering points, the thermal resistance is small, and the uneven heat conduction caused by the welding process / structure is also avoided , the fixing process of the LED chip is simple, the structure is simple, and the processing speed is fast.

Description

technical field [0001] The invention relates to a structure of an LED module and a manufacturing process thereof. Background technique [0002] LED is becoming more and more popular in the field of lighting, so the demand for its products is also increasing. From spotlight lamps to general lighting including various floodlights, a variety of LED modules have emerged as the times require. Its purpose is to replace the structure of traditional light sources such as incandescent lamps and fluorescent lamps that have been widely used, so as to obtain existing or even better lighting performance. [0003] Considering the characteristics of the LED light source, when it is necessary to realize a large-area illuminant, a large number of LED chip particles must be mounted on various forms of substrates, such as long strips of light, so that it has a uniform The luminous surface, on the one hand to obtain a better heat dissipation effect, on the other hand has a suitable geometry to...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems of poor heat dissipation of the PCB substrate in the existing LED module structure and production process, the contact and thermal resistance caused by LED chip welding, and the shortcomings of the existing LED module that are difficult to achieve high light efficiency, the present invention proposes an LED The structure of the module and its manufacturing process, its technical scheme is as follows:

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