Inductance element
A technology of inductive components and conductive layers, applied in electrical components, inductors, fixed inductors, etc., can solve the problems of changes in magnetic properties, easy peeling of conductive paste, and inability to ensure the adhesion of conductive paste and external resin, etc., to achieve stability Magnetic properties, the effect of ensuring tightness
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Embodiment 1
[0068] Covering resin layer: Silicone epoxy varnish (modified silicone resin) ES-1001N (manufactured by Shin-Etsu Chemical Co., Ltd.)
[0069] A solvent (xylene, butanol, diacetone alcohol) was added to dilute to a viscosity of 10 mPa·s.
[0070] Curing conditions: After drying at 70° C. for 30 minutes, it was cured by heating at 200° C. for 45 minutes.
Embodiment 2
[0072] Covering resin layer: Silicone epoxy varnish (modified silicone resin) ES-1023 (manufactured by Shin-Etsu Chemical Co., Ltd.)
[0073] A solvent (xylene, diacetone alcohol) was added to dilute to a viscosity of 200 mPa·s.
[0074] Curing conditions: After drying by heating at 70° C. for 30 minutes, it was cured by heating at 200° C. for 45 minutes.
Embodiment 3
[0076] Covering resin layer: Silicone polyester varnish (polyester silicone) KR-5230 (manufactured by Shin-Etsu Chemical Co., Ltd.)
[0077] A solvent (propylene glycol monomethyl ether acetate: PGMAC) was added and diluted to a viscosity of 300 mPa·s.
[0078] Curing conditions: After drying by heating at 70° C. for 20 to 30 minutes, heating and curing by heating at 200° C. for 45 minutes.
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