Copper alloy frame material strip for etching and preparation method of strip

A frame material and copper alloy technology, which is applied in the field of copper alloy frame material strips for etching and its preparation, can solve the problems of electroplating, packaging and other processes that cannot be carried out smoothly, distortion, warping, etc., and achieve the reduction of residual internal stress and low The effect of simple cost and process

Active Publication Date: 2015-06-24
TAIYUAN JIN XI CHUNLEI COPPER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the high-strength strip product is etched downstream, due to the residual stress inside the strip, deformation phenomena such as twisting and warping often occur, resulting in subsequent electroplating, packaging and other processes that cannot be carried out smoothly

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Alloy composition: Ni2.3%, Si0.5%; Mg0.1%; Fe0.05%; Mn0.002%; Zn0.005%; Cu97.043%.

[0022] Add other components into molten copper, and cast after mixing evenly. The cast ingot is hot rolled at 950°C, and the strip billet (16mm) after rolling at 700°C is quenched at a cooling rate of 25°C / s.

[0023] Cold rolling to 2.5mm thick for second phase precipitation strengthening annealing (530°C, 6h), then cold rolling to 1.0mm thick for recrystallization annealing (480°C, 7h), then cold rolling to pre-finished product thickness 0.4mm thickness annealing (450°C, 6h), the finished product rolling is 0.127mm.

[0024] Perform tension leveling (elongation rate 0.35%, tension leveling area tension 300N / mm 2 , coiling tension 40N / mm 2 ) to improve the plate shape, low-temperature heat treatment (temperature 400°C, time 25s), and at the same time, perform surface cleaning treatment to obtain the finished strip.

Embodiment 2

[0026] Alloy composition: Ni3.2%, Si0.75%; Mg0.25%; Fe0.2%; Mn0.01%; Zn0.015%; Cu95.575%.

[0027] Add other components into molten copper, and cast after mixing evenly. The cast ingot is hot rolled at 950°C, and the strip billet (16mm) after rolling at 700°C is quenched at a cooling rate of 25°C / s.

[0028] Cold rolling to 2.5mm thick for second phase precipitation strengthening annealing (530°C, 6h), then cold rolling to 1.0mm thick for recrystallization annealing (480°C, 7h), then cold rolling to pre-finished product thickness 0.4mm thickness annealing (450°C, 6h), the finished product rolling is 0.127mm.

[0029] Perform tension leveling (elongation rate 0.35%, tension leveling area tension 300N / mm 2 , coiling tension 40N / mm 2 ) to improve the plate shape, low-temperature heat treatment (temperature 400°C, time 25s), and at the same time, perform surface cleaning treatment to obtain the finished strip.

Embodiment 3

[0031] Alloy composition: Ni2.5%, Si0.55%; Mg0.08%; Fe0.1%; Mn0.005%; Zn0.008%; Cu96.757%.

[0032] Add other components into molten copper, and cast after mixing evenly. The cast ingot is hot rolled at 980°C, and the strip billet (16mm) after rolling at 720°C is quenched at a cooling rate of 25°C / s.

[0033] Cold rolling to 2.0mm thick for second phase precipitation strengthening annealing (530°C, 6h), then cold rolling to 1.0mm thick for recrystallization annealing (480°C, 7h), then cold rolling to pre-finished product thickness 0.3mm thickness annealing (450°C, 6h), the finished product rolling is 0.127mm.

[0034] Perform tension leveling (elongation rate 0.35%, tension leveling area tension 300N / mm 2 , coiling tension 40N / mm 2 ) to improve the plate shape, low-temperature heat treatment (annealing temperature 400°C, time 30s), and at the same time, perform surface cleaning treatment to obtain strip products.

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PUM

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Abstract

The invention relates to a copper alloy frame material strip for etching, and the copper alloy frame material strip is low in residual internal stress; the strip is prepared from the following alloy components: 2.2-4.2% of Ni, 0.25-1.2% of Si, 0.05-0.30% of Mg, 0.01-0.2% of Fe, 0.002-0.01% of Mn, 0.005-0.015% of Zn and the balance of Cu; the strip is prepared by the following steps: uniformly mixing the alloy components and casting; performing hot-rolling, cooling and quenching on an ingot, wherein the initial hot-rolling temperature is 850-1000 DEG C, the final temperature is 700-800 DEG C, and a rolled strip blank is quenched at a cooling speed of 10-30 DEG C/s; and then carrying out annealing, straightening and withdrawing, and low-temperature heat treatment for three times so as to obtain a finished product. By selecting an appropriate alloy component proportion as well as processes of controlling hot-rolling, quenching temperature, aging heat treatment system, straightening and withdrawing as well as low-temperature heat treatment, the purpose of reducing the internal residual stress of the strip can be achieved.

Description

technical field [0001] The present invention relates to a new material, especially a strip of copper alloy frame material for etching and a preparation method thereof. Background technique [0002] Copper alloy frame materials have high strength, high electrical conductivity, low thermal expansion, platability and excellent processing characteristics, etc., and have huge market potential in electronic fields such as integrated circuits and semiconductor components. With the development of large-scale integrated circuits and ultra-large-scale integrated circuits, electronic packaging is developing in the direction of short, small, light and thin, and lead frames will develop in the direction of multi-leads and small spacing. Therefore, etching molding processing methods are more widely used. [0003] The frame material for etching not only needs to have high performance, but also requires extreme residual stress. At present, the frame material strip for etchin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22F1/08
CPCC22C9/06C22F1/002C22F1/08
Inventor 陈清香张文芹张斌张晓敏樊华丽孟培一王全仁韩彩香朱永杰郑小英
Owner TAIYUAN JIN XI CHUNLEI COPPER CO LTD
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