Wet etching equipment and photoresist cleaning developing device

Abstract

The invention discloses wet etching equipment and a photoresist cleaning developing device. The wet etching equipment comprises a shell, a liquid loading basin, an ultrasonic nebulizer, an etching basket, an etched device and a power supply module, wherein a control panel is arranged on an outer wall of the shell, the liquid loading basin is arranged in the shell and is used for loading a solution, a basin edge of the liquid loading basin is fixedly connected with an inner wall of the shell, the ultrasonic nebulizer is fixedly arranged at the bottom of the liquid loading basin and is used foratomizing the solution in the liquid loading basin to liquid drops, the etching basket is arranged at the basin edge of the liquid loading basin and is used for loading the etched device, the etched device is separated from the solution, the power supply module is arranged at the bottom of the shell, the ultrasonic nebulizer is electrically connected with the control panel, and the ultrasonic nebulizer and the control panel both are electrically connected with the power supply module. The etched device is separated from the solution by the etching basket, the etching liquid is atomized by theultrasonic nebulizer, the device is etched by the atomized liquid drops, so that a hollow or lattice fine complicated structure is stably released, and the success rate of etching the fine complicatedstructure is provided.

Description

technical field [0001] The invention belongs to the technical field of MEMS (micro-electromechanical systems), and in particular relates to a wet etching device and a photoresist cleaning and developing device. Background technique [0002] Photolithography is an important step in the manufacturing process of semiconductor devices. This step uses exposure and development to describe the geometric pattern structure on the photoresist layer, and then transfers the pattern on the photomask to the substrate by etching. [0003] Etching is most commonly divided into: dry etching and wet etching. Wet etching is a purely chemical reaction process, which refers to using the chemical reaction between the solution and the pre-etching material to remove the part not masked by the masking film material to achieve the purpose of etching. [0004] However, the existing wet etching usually puts the required etching device into the etching solution and soaks it. When this process method is...

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Problems solved by technology

[0004] In the existing wet etching, the required etching device is usually soaked in the etching solution. When this process method is used to etch the small-sized (5 micron) complex and precise device structures such as hollows and grids, when it is used When the etching device leaves the etching liquid surface, due to the surface tension of the liquid, the fine structures such as hollows and grids will be broken and broken

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