Method for manufacturing uniform-heating plate with foam copper as liquid absorption core

A manufacturing method and technology of foamed copper, applied in indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of difficult control of the overall uniformity and flatness of the sintering effect, poor capillary suction effect, etc., and achieve obvious reflux effect, Improve heat dissipation effect, combined with good effect

Active Publication Date: 2015-07-08
JIANGSU KAIWEIDI TECHNOLOGY CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The former copper powder sintered structure is difficult to control the sintering effect, especially the overall uniformity and flatness due to the preparation of a large planar structure; while the latter woven copper

Method used

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  • Method for manufacturing uniform-heating plate with foam copper as liquid absorption core
  • Method for manufacturing uniform-heating plate with foam copper as liquid absorption core
  • Method for manufacturing uniform-heating plate with foam copper as liquid absorption core

Examples

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example 1

[0026] Example 1, the manufacture of a soaking plate with a thickness of 2.6 mm: both the upper cover plate and the lower bottom plate are made of copper plates with a thickness of 0.6 mm, which are molded into Figure 4 As shown, the height of the formed chamber is 1.4mm, and the copper injection capillary is welded, and the foam copper with a thickness of 0.3mm produced by Jiangsu Geye New Material Technology Co., Ltd. is used to diffuse the surface of the upper cover plate and the lower plate respectively. Method of sintering and combining, and then select the graded porous copper with a thickness of 0.8mm produced by Jiangsu Geye New Material Technology Co., Ltd. to form a Φ5mm cylinder (such as Figure 4 Shown), press (as Figure 4 As shown), as for the diffusion bonding between the upper cover and the lower bottom plate, the heat-resistant steel mold is used to compress the upper cover and the lower bottom plate, so that the edge joint part is in good surface contact. In the...

example 2

[0027] Example 2, the manufacture of a soaking plate with a thickness of 3.6mm: a copper plate with a thickness of 1mm in the lower base plate is used, and a copper plate with a thickness of 0.6mm in the upper cover plate is molded into Figure 5 As shown, the height of the formed steam chamber is 2mm, and the copper injection pipe is welded, and the 0.5mm thick foamed copper produced by Jiangsu Geye New Material Technology Co., Ltd. is used on the inner surface of the upper and lower cover plates through diffusion mode. After sintering, the porous copper with a thickness of 1.0mm produced by Jiangsu Geye New Material Technology Co., Ltd. is cut into 3x8mm 3 x 5 strips (such as Image 6 Shown), press (as Image 6 As shown), as for the upper and lower cover plates, by diffusion welding, graphite is used as a mold to compress the upper and lower cover plates, and the upper and lower covers (including the sintered copper foam) and The support columns (foamed copper) are combined t...

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Abstract

The invention discloses a method for manufacturing a uniform-heating plate with foam copper as a liquid absorption core. The foam copper which is manufactured in a grading manner and has the different thicknesses and the porosity is sintered on an upper cover plate and a lower bottom plate manufactured through copper plates or copper foil of the corresponding different thicknesses, and through welding, vacuumizing, liquid injecting and packaging, the uniform-heating plate is manufactured. A cylindrical foam copper supporting column which is manufactured in a grading manner and has a certain thickness(generally larger than or equal to 0.8mm) is adopted by a middle steam cavity, rapid flowing of gas-liquid phase media is ensured, and medium phase change circulation speed is increased; and the foam copper which is manufactured in a grading manner is provided with a good capillary structure, and is uniform in pore structure distributing and high in porosity. The uniform-heating plate with foam copper as the liquid absorption core has the advantages of being high in heat dissipation efficiency, small in weight, suitable for manufacturing an ultra-thin structure, and capable of meeting the requirement of semiconductor electronic equipment with the high heat flow density for high heat conduction efficiency and miniaturization. The uniform-heating plate is low in manufacturing cost, high in manufacturing precision and suitable for purposes of heat radiation of a computer chip, cooling of high-energy electronic chips or photoelectric chips or radio frequency chips of the wireless or wire communication industry and the like.

Description

technical field [0001] The invention relates to a two-dimensional (planar) structure rapid heat dissipation device in semiconductor and electronic equipment, that is, a soaking plate and its manufacturing method, especially a soaking plate using foamed copper with a high-porosity graded structure as a liquid-absorbing core. Hot plate and its preparation method. Background technique [0002] With the rapid development of semiconductor and electronic technology, higher requirements are put forward for the heat dissipation of chips. The traditional heat dissipation method is to use fans to force convection to cool metal radiators. This method is far from meeting the high heat flux density of current chips. and miniaturization requirements of electronic equipment. The application of heat pipe technology solves the problem of using one-dimensional structural features to quickly export high heat flux and dissipate heat. The working principle of the vapor chamber is similar to th...

Claims

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Application Information

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IPC IPC(8): F28D15/04
Inventor 施忠良朱春芳王虎
Owner JIANGSU KAIWEIDI TECHNOLOGY CO LTD
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