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Polyimide precursor, polyimide, varnish, polyimide film, and substrate

A polyimide precursor, polyimide film technology, applied in the direction of coating, can solve the problems of undocumented polyimide transparency or linear thermal expansion coefficient, etc., and achieve high heat resistance and high transparency , the effect of high transparency

Active Publication Date: 2015-07-08
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the transparency and linear thermal expansion coefficient of the obtained polyimide are not described.

Method used

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  • Polyimide precursor, polyimide, varnish, polyimide film, and substrate
  • Polyimide precursor, polyimide, varnish, polyimide film, and substrate
  • Polyimide precursor, polyimide, varnish, polyimide film, and substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0177] Charge DABAN 0.68g (3 millimoles) and TFMB 2.24g (7 millimoles) in the reaction vessel that has been replaced with nitrogen, and add so that the feed total mass of monomer (diamine component and carboxylic acid group 23.79 g of N,N-dimethylacetamide in an amount of 20% by mass) was stirred at room temperature for 1 hour. To this solution was slowly added DNDAxx 3.02 g (10 mmol). After stirring at room temperature for 12 hours, a homogeneous and viscous polyimide precursor solution was obtained. The logarithmic viscosity of the obtained polyimide precursor was 0.5 dL / g.

[0178] Apply the polyimide precursor solution filtered with a PTFE membrane filter on a glass substrate, and heat it directly on the glass substrate from room temperature to 430°C under a nitrogen atmosphere (oxygen concentration: 200ppm or less). By imidization, a colorless and transparent polyimide film / glass laminate was obtained. Next, the obtained polyimide film / glass laminate was immersed in wa...

Embodiment 2

[0181] Charge DABAN 1.14g (5 millimoles) and TFMB 1.60g (5 millimoles) in the reaction vessel that has been replaced with nitrogen, and add so that the feed total mass of monomer (diamine component and carboxylic acid group 23.04 g of N,N-dimethylacetamide in an amount of 20% by mass) was stirred at room temperature for 1 hour. To this solution was slowly added DNDAxx 3.02 g (10 mmol). After stirring at room temperature for 12 hours, a homogeneous and viscous polyimide precursor solution was obtained. The logarithmic viscosity of the obtained polyimide precursor was 0.6 dL / g.

[0182] Apply the polyimide precursor solution filtered with a PTFE membrane filter on a glass substrate, and heat it directly on the glass substrate from room temperature to 430°C under a nitrogen atmosphere (oxygen concentration: 200ppm or less). By imidization, a colorless and transparent polyimide film / glass laminate was obtained. Next, the obtained polyimide film / glass laminate was immersed in wa...

Embodiment 3

[0185] Charge DABAN 1.59g (7 millimoles) and TFMB 0.96g (3 millimoles) in the reaction vessel that has been replaced with nitrogen, and add so that the feed total mass of monomer (diamine component and carboxylic acid group 22.30 g of N,N-dimethylacetamide in an amount of 20% by mass) was stirred at room temperature for 1 hour. To this solution was slowly added DNDAxx 3.02 g (10 mmol). After stirring at room temperature for 12 hours, a homogeneous and viscous polyimide precursor solution was obtained. The logarithmic viscosity of the obtained polyimide precursor was 0.5 dL / g.

[0186] Apply the polyimide precursor solution filtered with a PTFE membrane filter on a glass substrate, and heat it directly on the glass substrate from room temperature to 430°C under a nitrogen atmosphere (oxygen concentration: 200ppm or less). By imidization, a colorless and transparent polyimide film / glass laminate was obtained. Next, the obtained polyimide film / glass laminate was immersed in wa...

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Abstract

The present invention relates to a polyimide precursor including a repeating unit expressed by chemical formula (1), wherein the polyimide precursor is characterized in that A includes at least two repeating units expressed by chemical formula (1) that is a group expressed by any of chemical formulas (2-1), (2-2), (3) or (4), and a polyimide obtained from the polyimide precursor has a linear thermal expansion coefficient of 50 ppm / K or less at 50 to 200°C, and a transmittance of at least 75% at a wavelength of 400 nm and a polyimide film thickness of 10 mum (in the formula, A represents a bivalent group excluding an amino group from an aromatic diamine or an aliphatic diamine; and X1 and X2 individually represent hydrogen, a C1-6 alkyl group, or a C3-9 alkylsilyl group).

Description

technical field [0001] The present invention relates to a polyimide and its precursor, etc., which have excellent properties such as high heat resistance and bending resistance, and have high transparency and extremely low linear thermal expansion coefficient. Background technique [0002] In recent years, with the advent of an advanced information society, optical materials such as optical fibers and optical waveguides in the field of optical communications, and optical materials such as liquid crystal alignment films and protective films for color filters in the field of display devices have been developed. In particular, in the field of display devices, lightweight and highly flexible plastic substrates are being studied as a substitute for glass substrates, and bendable or rollable displays have been actively developed. Therefore, a higher-performance optical material that can be used for various purposes is being sought. [0003] Aromatic polyimide is substantially col...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18
CPCC08G73/1075C08G73/105C08G73/1078C08G73/1042C09D179/08C08G73/14C08G73/1039C08J5/18C08J2379/08C08G73/1007
Inventor 冈卓也小滨幸德渡辺祥行久野信治
Owner UBE IND LTD
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